Memory test system SM-ZOV665-W5(10)K
heat cyclefunctional safetyaging

Memory test system - SM-ZOV665-W5(10)K - Sanwood Technology - heat cycle / functional safety / aging
Memory test system - SM-ZOV665-W5(10)K - Sanwood Technology - heat cycle / functional safety / aging
Memory test system - SM-ZOV665-W5(10)K - Sanwood Technology - heat cycle / functional safety / aging - image - 2
Memory test system - SM-ZOV665-W5(10)K - Sanwood Technology - heat cycle / functional safety / aging - image - 3
Memory test system - SM-ZOV665-W5(10)K - Sanwood Technology - heat cycle / functional safety / aging - image - 4
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Characteristics

Test type
performance, thermal, functional safety, heat cycle, aging
Domain
for the electronics industry
Applications
for semiconductors, integrated circuit, PCB, memory
Configuration
on site
Other characteristics
automatic, multi-transducer

Description

SANWOOD Double-Door Dynamic IC Burn-in and HTOL Test System

The SANWOOD SM-ZOV665-W5(10)K combines two heated chambers with programmable electrical test patterns for parallel dynamic burn-in and high-temperature operating life (HTOL) testing. Each chamber accommodates 16 horizontally mounted burn-in boards (BIBs), for a total of 32 board slots.

Key Features

Programmable test vectors exercise powered ICs at elevated temperatures.

Slot-level isolation and overcurrent protection help contain faults during parallel testing.

Horizontal airflow across the board racks helps distribute heat under powered loads.

Technical Specifications

Model — SM-ZOV665-W5(10)K, double-door configuration

Chamber temperature range — Ambient +10°C to +150°C

BIB capacity — 32 slots total, 16 per chamber

BIB size — 450 × 570 mm

Signal channels — 184 total, comprising 160 common driver channels and 24 I/O channels

Maximum system repetition rate — 20 MHz

Vector memory — 64M words

Error log capacity — 2K per I/O

Device power supply — 8 channels per BIB in the default configuration

Internal dimensions per chamber (W × H × D) — 800 × 1,320 × 630 mm

Overall dimensions (W × H × D) — 3,160 × 2,470 × 1,600 mm

Customization

Chamber interior dimensions and test rack configurations can be customized to accommodate your board size, board spacing and loading requirements.

Applications and Test References

Designed for parallel reliability testing of automotive SoCs, microcontrollers, AI accelerators, memory ICs and power management ICs. Depending on the device and test plan, relevant references include JEDEC JESD22-A108 for HTOL, AEC-Q100 Test B1 for automotive IC HTOL and MIL-STD-883 Method 1015 for microcircuit burn-in.

For a configuration proposal, share your device type, BIB drawings, target throughput, powered heat load and test profile.

Product page — https://www.sanwood.us/products/188.html

Email — info@sanwood.com

Exhibitions

Meet this supplier at the following exhibition(s):

electronica Munich 2026
electronica Munich 2026

10-13 Nov 2026 Munich (Germany) Hall C2 - Stand 130

  • More information
    Semicon
    Semicon

    10-13 Nov 2026 Munich (Germany) Hall C2 - Stand 130

  • More information
    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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