Fine pitch probe card

As technology advances, the gap between front-end and back-end testing methods has closed. While cantilever probes were traditionally used for front-end testing, and contact probes for back-end testing, emerging devices like WL-CSP, Flip Chip, and Copper Pillar require more advanced solutions that cantilever probes alone cannot provide. Seiken has redefined the standards of fine-pitch testing with our innovative contact probe card, capable of handling pitches as small as 130μm—going beyond the conventional advanced-type cards, which typically support pitches of 100μm or more. Key Features & Advantages - Flexible grid layout: Easily accommodates grid layouts and multi-contact designs, offering a level of versatility that traditional cantilever probes cannot match. Maintenance is also simplified, with easy probe replacements that improve efficiency and reduce downtime. - Ready for volume production: Whether you’re working with a single unit for prototyping or need larger-scale production, Seiken provides consistent quality, ensuring your testing needs are met at every stage. Application Examples - WL-CSP - FlipChip - Copper Pillar Related Products - Fine-Pitch Technology: Seiken’s fine-pitch probes provide reliable testing for today’s advanced semiconductor devices. Supporting pitches as small as 130µm, they are precision-machined for today’s ultra-compact component layouts. - Fine-Pitch IC Sockets: Using Seiken’s innovative tubeless probe design, these sockets provide secure contact for electrodes as fine as 130µm pitch. Perfect for next-generation miniaturized devices, they ensure stable testing in even the tightest configurations. - Probe Holders (Custom Test Fixtures): Also known as Pin blocks, Probe Holders are essential for precision probing in electronic component testing. Our probe holders ensure perfect alignment and stable contact—whether you're using standard formats or need a fully customized design. Trust Seiken to deliver reliability at the contact point. Technical Specifications / Features - Supports fine pitch down to 130μm - Compatible with WL-CSP, Flip Chip, Copper Pillar devices - Flexible grid and multi-contact layouts - Easy probe replacement for reduced downtime - Ready for both prototyping and volume production