LED spacer

Outline
Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices.

Features
Improve bonding yield with device wafers

• Control sagging around the holes
• Minimize chipping size
• Availability down to ≦10 μm for controlled chipping

Options

• Remove microcracks from machined surfaces to control particles
• Prevent malfunctions in bonding with MEMS devices caused by particles

Standard specifications

• Material: Glass
• Maximum glass diameter: ≦φ200 mm
• Minimum thickness: 0.15 mm
• Thickness tolerance: ±0.01 mm
• Minimum hole size: φ0.3 mm
• Window shape: available upon request
• Window size tolerance: ±0.02 mm
• Chipping size: ≦100 μm (can be controlled to ≦10 μm)
• Cross-section shape: Straight / Taper / Step
• Metallization process: Available

End user market / Applications

• Projector
  • Display devices for projectors and similar applications
• Semiconductor
  • RF-MEMS switches
  • Image sensors
• AV / Mobile
  • RF-switches/relays for smartphones, portable consoles, digital cameras, car navigation systems
• Automotive
  • Pressure sensors, acceleration sensors
  • Gyroscopes, LED components
• Biotechnology / Medical
  • Analytical chips for DNA/drug-discovery-screening analyzers
  • Microreactors for biochemical reaction/electrophoresis analyzers
  • Bioreactors for chemical/microorganism-detection sensors
  • Industrial gas-detection sensors

Characteristics / Technical specifications

• Target: Multilayer assembly of semiconductor wafers, including MEMS devices
• Material: Various glass types
• Maximum glass diameter: ≦φ200 mm
• Minimum thickness: 0.15 mm
• Thickness tolerance: ±0.01 mm
• Minimum hole size: φ0.3 mm
• Window shape and sizes: available upon request (window size tolerance ±0.02 mm)
• Chipping control: ≤100 μm standard; controllable to ≦10 μm
• Through-hole cross-section options: Straight, Taper, Step
• Metallization: Available
• Options: Microcrack removal and surface treatment to reduce particles and improve bonding yield