Glass

Overview
Anodic bonding with a silicon wafer eliminates the need for adhesives and helps resolve out-gassing issues, enabling use in wafer-level packaging (WLP) processes.

Key features

• Micro-hole processing: minimum hole diameter φ0.1mm
• Maximum glass size: up to φ300 mm (some processes limited to φ200 mm)
• Improved bonding yield: suppressed sagging around holes and minimized chipping (≤10 μm available)

Standard specifications

• Material: glass
• Glass size: ≤ φ300 mm (*)
• Minimum thickness: 0.15 mm
• Thickness tolerance: ±0.01 mm
• Minimum hole size: φ0.1 mm
• Hole shape: upon request (straight / taper / step)
• Hole size tolerance: ±0.02 mm
• Chipping: ≤100 μm (special processing can reduce to ≤10 μm)
• Metallization: available

Sagging comparison
Sharp edge type
Sagging width: <10 μm
Sagging depth: <0.1 μm

Standard type
Sagging width: >400 μm
Sagging depth: >0.7 μm

Chipping comparison
Less-chipping type
(illustrated comparison available on product page)
Standard type
(illustrated comparison available on product page)

End user markets / Applications

• Automotive
  • Pressure sensors
  • Acceleration sensors
  • Gyroscopes
• Semiconductors
  • RF-MEMS switches
  • Image sensors

Technical specifications

• Material: glass
• Glass size: ≤ φ300 mm (some processes limited to φ200 mm)
• Minimum thickness: 0.15 mm
• Thickness tolerance: ±0.01 mm
• Minimum hole size: φ0.1 mm
• Hole size tolerance: ±0.02 mm
• Hole shape: straight / taper / step (on request)
• Chipping: ≤100 μm (special processing available to achieve ≤10 μm)
• Cross-section shape: straight / taper / step
• Metallization: available
• Compatible with anodic bonding to silicon wafers for WLP