Mesh

Outline
Square micro through-holes without rounded corners (R=0) enabling narrow-pitch and small-diameter patterns that were previously impractical.

Features

• High-density micro through-holes
  • Example: up to 150,000 holes of 0.1×0.1 mm on a 3‑inch wafer
• High aspect-ratio through-holes (up to 1:10)
  • Typical aspect ratio range 1:8–1:10; straight or tapered cross-sections available
• Minimized chipping
  • Improves contact for anodic bonding to Si

Options

• Sidewall metallization
  • Reduces optical interference or absorption between holes
• Selectable cavity geometry

Standard specifications
Material: Borofloat 33 (BF33) etc.
Glass size: ≦φ150 mm
Min. thickness: 0.25 mm
Thickness tolerance: ±0.01 mm
Min. hole size: □0.07 mm
Hole size tolerance: ±0.02 mm
Max. aspect ratio: 1 : 10
Particle control: Available
Cross-section shape: Straight / Tapered

Characteristics / technical specifications

• Material: Borofloat 33 (BF33) etc.
• Glass size: ≦φ150 mm
• Minimum thickness: 0.25 mm; tolerance ±0.01 mm
• Minimum hole size: square 0.07 mm; tolerance ±0.02 mm
• Maximum aspect ratio: up to 1 : 10 (typ. 1:8–1:10)
• Cross-section: straight or tapered through-holes
• High-density microholes: e.g. 150,000 holes of 0.1×0.1 mm on a 3‑inch wafer
• Sidewall metallization available to control optical interference/absorption
• Particle control and cleanroom handling available
• Minimized chipping to improve anodic bonding performance