Sheet glass

Outline
Hi-precision cavities are formed inside glass wafers to provide thin, transparent cavity bottoms that allow optical transmission or direct observation (e.g., oil-immersion microscopy). The cavities can be produced in various shapes and cross-sections to meet optical and packaging requirements.

Features
Transparent finish on the cavity bottom
Thin, transparent cavity bottom finish for unobstructed transmission of laser or LED light and for high-resolution optical observation.

Metallization and geometry options
Top, bottom and sidewalls can be metallized to form electrodes, traces or shielding. Cavity cross-sections available: straight, taper and step. Various cavity shapes supported.

Applications
Projector

• Display components for projection systems and pico-projectors.

Semiconductor

• RF-MEMS switches and packages; image sensors and sensor covers.

AV / Mobile

• RF switches/relays, pressure sensors, gyroscopes, accelerometers and image sensors for smartphones, portable consoles, digital cameras and car navigation systems.
• Display components for mobile devices.

Automotive

• Pressure sensors, acceleration sensors, gyroscopes, LED covers and other automotive sensor housings.

Standard specifications

• Material: Glass
• Glass size: ≤φ200 mm
• Minimum thickness: 0.15 mm
• Thickness tolerance: ±0.01 mm
• Minimum cavity size: φ0.1 mm / □0.07 mm
• Cavity shape: no restriction
• Cavity size tolerance: ±0.02 mm
• Chipping: ≤10 μm
• Cavity cross-section: Straight / Taper / Step
• Metallization: Possible on top, bottom and sidewalls

Technical characteristics

• High-precision cavities formed inside glass wafers with optically transparent thin bottoms.
• Transparent bottom finish supports laser/LED transmission and microscopy observation.
• Top, bottom and sidewall metallization available for electrodes, wiring and shielding.
• Flexible cavity geometry and tight dimensional tolerances suitable for semiconductor and optical applications.