Double-sided printed circuit board

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Overview
Our Custom OEM Surveillance Tower PCB Assembly Services deliver end-to-end PCBA manufacturing for specialized surveillance tower systems. Solutions are fully assembled, tested and integrated to meet specific design, RF and environmental requirements, with options for rapid prototypes and scalable volume production.

Service Parameters

• Board Types: Single-sided, double-sided and multi-layer PCB assemblies up to 20 layers.
• Components: Support for BGA, QFN, 0201 passives and mixed SMT/THT assembly.
• Assembly Process: Lead-free RoHS-compliant soldering, automated optical inspection (AOI), and X-ray inspection for BGA.
• Testing: In-circuit testing (ICT), functional testing (FCT), and environmental stress screening (ESS) upon request.
• Lead Time: Prototypes in 5–15 business days; volume production per project schedule.

Materials & Construction

• PCB Materials: FR-4 Standard / Halogen-Free, High-TG FR-4, Aluminum substrate, or Rogers material for RF.
• Surface Finishes: ENIG (Electroless Nickel Immersion Gold), HASL-LF, Immersion Silver, or OSP.
• Conformal Coating: Optional acrylic, silicone, or urethane coatings for environmental protection.

Application Scenarios

• Custom surveillance towers for perimeter security (e.g., airports, critical infrastructure).
• Mobile and rapid-deployment security towers.
• Integrated systems with thermal cameras, radar, and communication modules.
• Long-range and AI-powered surveillance platforms.

Service Advantages

• Full Turnkey Solution: Management of the entire process from component sourcing to final assembly.
• Design for Manufacturing (DFM): Expert DFM analysis to improve reliability and yield.
• Scalable Production: Seamless transition from prototypes to high-volume manufacturing.
• Supply Chain Management: Stable component sourcing and BOM optimization for cost-efficiency.
• Quality Certified: ISO 9001:2015 compliant processes with full traceability.

Characteristics / Technical Specifications

• Board Layers: up to 20 layers (single-sided, double-sided, multi-layer).
• Component Support: BGA, QFN, 0201 passives, mixed SMT and THT.
• Soldering & Process Controls: Lead-free RoHS-compliant soldering; AOI; X-ray inspection for BGA.
• Testing Options: ICT (In-Circuit Test); FCT (Functional Test); ESS (Environmental Stress Screening) on request.
• Lead Time: Prototypes 5–15 business days; volume production per project schedule.
• PCB Materials: FR-4 Standard / Halogen-Free; High-TG FR-4; Aluminum substrate; Rogers for RF.
• Surface Finishes: ENIG; HASL-LF; Immersion Silver; OSP.
• Conformal Coating Options: Acrylic, silicone, urethane.
• Applications: Perimeter security towers, mobile/rapid-deploy towers, thermal/radar/communication integrated systems, long-range AI surveillance platforms.
• Quality & Compliance: ISO 9001:2015 compliant processes with full traceability.