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Diamond wire cutting machine SH40-RdiamondwaferPLC-controlled
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Characteristics
- Technology
- diamond wire, diamond
- Product handled
- wafer
- Control type
- PLC-controlled
- Applications
- for industrial applications, for processing industry
- Workpiece loading
- manual loading
- Phase
- single-phase
- Configuration
- compact, single-head, with rotating table, 3-axis
- Other characteristics
- automatic, precision, CE, horizontal
- Y travel
Max.: 560 µm
Min.: 280 µm
- Z travel
300 mm
(12 in)- Cutting speed
2,100 mm/min
(1.378 in/s)- Laser power
4,500 W
- Height
260 mm
(10 in)- Weight
1,200 kg
(2,645.55 lb)- Power supply
220 V
- Load capacity
500 kg
(1,102.31 lb)
Description
The SG40-R Quartz Diamond Wire Cut Machine is a horizontal cutting solution engineered for precision slicing of crystal materials.
The HorizonCrystal Diamond Wire Cutter is a horizontal cutting solution engineered for precision slicing of large crystal materials. With a cutting capacity of up to 400mm in diameter and custom options available for greater sizes, this machine delivers fast, high-quality cuts surpassing traditional slicers. Its design ensures superior surface finish, meeting the exacting demands of crystal processing with efficiency and precision.
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Catalogs
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.