Cutting machine for the semiconductor industry SGC45

diamond wirefor monocrystalline siliconblocks

SGC45 is Optimized for the semiconductor industry, the 18 inch Silicon Ingot cutting machine is a dedicated device for cropping and seeding large monocrystalline silicon rods. SGC45 is Equipped with an endless diamond wire cutting tool, it provides seamless, high-precision cuts for ingots up to 18 inches in diameter. Designed to facilitate the efficient preparation of ingots for further processing, it stands out for its precision, minimal kerf loss, and adaptability to handle substantial silicon rod sizes, making it a critical asset for manufacturers aiming for top-tier production standards. This device is a diamond cutting equipment specifically designed for the semiconductor and photovoltaic industries to do Silicon Ingot Cutting . The cutting tool used is the latest closed-loop diamond wire, capable of segmenting the silicon rod and taking slices/seeds after the cutting process. SGC45 is designed for the cutting of 18-inch silicon rods, while a similar structure, SGC30, is suitable for cutting 12-inch silicon rods. Compared to diamond band saws and traditional single-wire cutting devices, this circular or endless diamond wire cutting equipment exhibits a lower edge chipping rate, superior cutting surface quality, and reduced material wastage.