Diamond wire cutting machine SFM 42390

for precious metalsfor monocrystalline siliconnumerical control

SFM 42390 is a multi wire saw specialized precision cutting equipment for various hard and brittle materials such as silicon wafers, semiconductors, glass, etc. This machine adopts our company's latest technology, featuring sensitive response and significantly reducing the risk of wire breakage. This Multi Wire Saw is used for: It is a specialized precision cutting equipment for various hard and brittle materials such as silicon wafers, semiconductors, glass, etc. This machine adopts our company’s latest technology, featuring sensitive response and significantly reducing the risk of fine wire breakage. Multi Wire Saw Main Features 1.High-speed cutting is realized, with a cutting speed of ≥2400 m/min and tension control accuracy of ±0.1N. 2.It adopts a complete Siemens/Huichuan servo system solution, achieving stable and high-precision cutting methods, producing silicon wafers, semiconductors, glass, and other materials that meet the requirements. 3.The wire collection and deployment sides introduce the shortest path into the cutting chamber, enabling bi-directional wire feeding. 4.The machine’s body is a cast piece, offering very high mechanical stability and thermal stability, thus ensuring the smoothness of the cutting process.