Sensor de visão para detecção de defeitos 100-SO-10-MAN-001
para semicondutorescom fonte de iluminação LED

Sensor de visão para detecção de defeitos - 100-SO-10-MAN-001 - OPTO - para semicondutores / com fonte de iluminação LED
Sensor de visão para detecção de defeitos - 100-SO-10-MAN-001 - OPTO - para semicondutores / com fonte de iluminação LED
Sensor de visão para detecção de defeitos - 100-SO-10-MAN-001 - OPTO - para semicondutores / com fonte de iluminação LED - imagem - 2
Sensor de visão para detecção de defeitos - 100-SO-10-MAN-001 - OPTO - para semicondutores / com fonte de iluminação LED - imagem - 3
Sensor de visão para detecção de defeitos - 100-SO-10-MAN-001 - OPTO - para semicondutores / com fonte de iluminação LED - imagem - 4
Guardar nos favoritos
Comparar

Características

Aplicações
para detecção de defeitos, para semicondutores
Outras características
com fonte de iluminação LED

Descrição

100-SO-10-MAN-001 Electronic Components Anomaly Opto solino RTI sensor

Overview
The Opto RTI Vision Sensor solino® is a complete computational imaging vision sensor that uses Opto's proprietary solino® technology to render object anomalies as images for further digital or statistical processing. It can be used to inspect Semicon packages and electronic components before assembly.

While Standard camera systems, which rely on fixed lighting conditions, often struggle with reflective metallic surfaces such as solder balls and Glare and reflections can hide defects or produce unreliable inspection results, the solino RTI sensor combines controlled illumination with computational imaging to reveal surface structures that are difficult to detect using traditional machine vision systems.

Because solino® captures the surface under 64 illumination directions, even small surface irregularities become visible with significantly enhanced contrast.

This enables reliable inspection of semiconductor packages, BGA solder arrays and electronic components, helping manufacturers improve quality assurance and reduce the risk of defects during electronic assembly.

The inspection system consists of:
• solino RTI sensor
• integrated dome illumination with 64 LEDs
• high-resolution 20 MP industrial camera
• solinoStudio software for image acquisition and processing

The sensor design allows integration into inspection stations or automated production systems.

Inspection workflow:
1. Electronic component is positioned under solino sensor
2. The system captures a series of images under varying illumination directions
3. Computational algorithms reconstruct the surface reflectance information
4. solinoStudio enables visualization of surface structures


solino® BRDF sensor for anomaly detection:
solino® is based on Bidirectional Reflection Distribution Function (BRDF) measurement – the physics behind visual appearance.

It uses 64 LEDs in a precisely calibrated dome to illuminate the surface from all directions. The reflected light is analysed to derive:

  • colour, waviness and roughness
  • reflectivity and inclination
  • surface stress and microstructure anomalies

solino® digitizes the visual appearance of objects and enables fully reproducible imaging of the smallest defects on scattering surfaces.
powerful plug & play imaging module
includes software for photometric stereo image acquisition
integrated 64 LED mesh dome illumination
redefinition of surface texture standards
robust design for easy automation

Applications:
Modern electronic assemblies rely on highly precise semiconductor packages and solder connections. Components such as BGA packages, processors and high-density electronic modules must meet extremely strict quality standards to ensure reliable electrical performance and long-term durability.

Manufacturers require reliable inspection methods for:
• solder ball arrays on BGA packages
• semiconductor chip packages
• contact pads and electrical interfaces
• microelectronic surface structures
• contamination or foreign particles on packages

The goal is to detect surface defects early in the production process and ensure consistent quality across all electronic components before assembly.


Advantages:
captures all surface features and anomalies
detection of roughness, reflectivity and tilt
eliminates reflections on metallic surfaces
detection of impurities on PCB surfaces


Specifications:
Magnification: 1x
FoV [mm]: 12,3 x 12,3
Working distance [mm]: 5
Camera: 20 MP, USB 3.2 Gen1
Object Space Resolution [μm/Px]: 2,7
DoF [mm]: 0,35
Image: Colour
Illumination: 64LED-Dome incl. controller
Dimensions [mm] (WxLxH) : 206 x 20x x 280.9
CE / RoHS / WEEE-Reg.-No. DE 68564667
Software: solinoStudio software and SDK included
solino Stand
solino Power Supply Package EU
USB cable, USB-C straight to USB-A, screwable, 1m

Feiras de negócios

Próximas feiras onde poderá encontrar este fornecedor

ADLM 2026
ADLM 2026

26-30 jul 2026 Anaheim (EUA - Califórnia) Stand 1067

  • Mais informações
    W3 + Fair
    W3 + Fair

    23-24 set 2026 Jena (Alemanha) Stand B10b

  • Mais informações
    Ver todas as feiras
    * Os preços não incluem impostos, transporte, taxas alfandegárias, nem custos adicionais associados às opções de instalação e de ativação do serviço. Os preços são meramente indicativos e podem variar em função dos países, do custo das matérias-primas e das taxas de câmbio.