Lithography

P. 3
Transfer chambers ? Load-lock chambers ? EUV lithography ? Solar cell coating ? Optical coating ? Surface finishing ? Simulation chambers Applications Dimensions Pump down and recovery time (0 ? 22 l) 100 mbar 10 mbar 1 mbar 0

P. 12
Fluorescence (XRF) ü Plasma Diagnostics ü ü Lithography EUV [UHV] ü ü [ü] ü Crystallography ü Neutronic Imaging / Tomography ü Image Relay Systems (e.g. slit scanners, streak tubes) ü Laser X Development

P. 80
employs LIGA-technology, a method combining lithography, electroforming and mold-copying. Special involute toothing with a module of 55 ìm and a reduction ratio of 3,6 : 1 per gear stage is used, providing the three stage gear motor combination with 150 ìNm torque

P. 8
machines, slow speed agitators, semiconductor lithography, and structural testing. Seismic monitoring applications such as earthquake detection, geophysics, geothermal development, and structural analysis

P. 3
lithography Chemical vapor deposition (CVD) Physical vapor deposition (PVD) Ion beam etching Ion implantation Research & Development Physical equipment Space simulation Coating Glass coating Thin fil