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The JBX-3050MV series is an electron beam lithography system for mask/reticle fabrication that meets the design rule of 45 to 32 nm. This system features pattern writing with high speed, high accuracy and high reliability, achieved by high-end technology.
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The OAI Model 5000 is an advanced, high-performance mask aligner and exposure tool that delivers ultra precise, front side, sub-micron alignment and resolution for the most demanding semiconductor device and surface MEMS applications.
The system is available in manual or fully automated versions, and is capable of performing sub-micron, level-to-level alignment. It's flexible design allows printing on various substrates - round or square - up to 200mm. The exposure system is compatible with photoresist in Near, Mid or Deep UV range.
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The OAI Model 8000 is an advanced, high-performance mask aligner and exposure tool that delivers ultra precise, front and back side, sub-micron alignment and resolution for the most demanding bulk and surface MEMS applications.
The system is available in manual or fully automated versions, and is capable of performing sub-micron, level-to-level alignment. It's flexible design allows printing on various substrates - round or square - up to 200mm. The exposure system is compatible with photoresist in Near, Mid or Deep UV range.
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