The OAI Model 5000 is an advanced, high-performance mask aligner and exposure tool that delivers ultra precise, front side, sub-micron alignment and resolution for the most demanding semiconductor device and surface MEMS applications.
The system is available in manual or fully automated versions, and is capable of performing sub-micron, level-to-level alignment. It's flexible design allows printing on various substrates - round or square - up to 200mm. The exposure system is compatible with photoresist in Near, Mid or Deep UV range.
The OAI Model 8000 is an advanced, high-performance mask aligner and exposure tool that delivers ultra precise, front and back side, sub-micron alignment and resolution for the most demanding bulk and surface MEMS applications.
The system is available in manual or fully automated versions, and is capable of performing sub-micron, level-to-level alignment. It's flexible design allows printing on various substrates - round or square - up to 200mm. The exposure system is compatible with photoresist in Near, Mid or Deep UV range.
