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... The model AT530 was specially designed for high speed bonding of IR filter in camera modules widely used in mobile phone industry. Contact us for more details. 3 Gel Dispensing Heads High speed production at 5000 ...
... After discharge of the COG Bonding device;2) A device with Edge Clean (option), ACF attachment, FPC (COF) false pressure and FPC (COF) self pressure; 3) To bond according to the positions of panel and FPC (COF);4) FOG Bonding ...
... ONSERT® Portable is a battery-operated manual installation tool which is suitable for manual processing. The joint between the workpiece and the ONSERT® fastener is produced using a light-curing adhesive. This is manually applied to an ONSERT® fastener, ...
... temperature of the adhesive Various designs can be created with Brother "ISC" technology. The applying of adhesive and the bonding of the cloth are performed at the same time, it contributes to the creation of new designs not limited ...
... LCD/ PDP Bonding and Repair Systems. The EM Series is designed for a wide variety of TAB and Flex sizes and can handle panel sizes ranging from 1" up to 65". The EM system is highly flexible and can ...
... Corrugated delivers
bonding, drying and web transport for flute sizes from micro-flute up to heavy triple-corrugated board. It is engineered for high line speeds and stable web quality across a range of board grades.
Platerol ...
... application system for end pins (on-line and off-line application) with ultrasonic bonding or clinching This unit is located after the roll forming machine or after the DALLAN DV1 destacker. It carries out a very fast ...
... Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating. Thermal Bonding ...
... Hand-Held Systems for Ultrasonic Plastic Bonding & Cutting Hand-held welding and cutting units allow for exceptional control and accuracy Ideal for cutting and bonding delicate ...
... Logitech’s WSBU Wafer Substrate Bonding Units are premium bonders for the processing of fragile semiconductor wafers such as silicon and gallium arsenide. The bonding units are designed to minimise breakage with these ...
... pipe. Simple operation PLC control system, manual waxing and placing, bonding process of pressing and cooling automatically Good compatibility Compatible with various size of wafers below 150mm ...
... Radyne brand ammunition annealing and bonding systems are used to make bullets for law enforcement and military applications, as well as for the hunting and shooting enthusiast. Radyne brand has a well-established history ...
... It is a manual bonding machine designed for prototyping and small series that allows high precision and high technology in bonding with a very limited investment. The machine puts no technological limits to the kind ...
Piergiacomi Sud Srl
... This machine is the deeply processing equipment of EPE foam sheet/film products, mainly used for the adhesive bonding and thickening of EPE foam sheet/film, increasing the intensity and thickness, widely used for the packing of electronic ...
... High class bonding for plastic parts by Schmidt & Heinzmann. The key element of the system consists of the heatable bonding tool. A shuttle table ensures a convenient component loading of the bonding ...
... metered and supply systems utilize automated fluid preparation technology for the highest possible yields. The Delta Bond System has two standard sizes, with custom sizing available. The small system ...
PVA
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