Glass polishing machine IBF series

for precision opticsindustrialautomated

Overview
Ion Beam Figuring (IBF) is a vacuum corrective polishing process using accelerated argon atoms to ablate material and correct surface errors down to a few nanometers with sub-millimeter local resolution. It is designed for final finishing of precision optical surfaces and complex geometries.

Key benefits

• Capable of polishing almost any shape: 6-axis direct drive keeps the ion source orthogonal to the workpiece, enabling machining up to and beyond surface edges.
• Surface qualities of λ/200 and better: Corrects very small surface errors to reach high optical surface quality suitable for final processing.
• Fully automated with high reproducibility: Iterative, fully automated workflow supports multiple apertures without intermediate workpiece measurement for predictable lead times.

Highlight features

• Advanced software — easy setup and simulation: User-friendly software analyses and visualizes measured data from multiple sources and prepares machining simulations; GUI is customizable for specific applications.
• ISERM — in-situ etch-rate measurement: Low-coherence measurement system determines the etch-rate profile of the ion source with high precision; interchangeable sample holder supports a wide range of materials and multiple measurements with a single head.
• Aperture changer — up to five diaphragms: Apertures can be changed during operation inside the vacuum chamber; supports up to five diaphragms with diameters from 0.5 mm to 20 mm.

Downloads

• Brochure for precision optics (PDF)
• IBF series technical data (PDF)

Technical specifications

• Process type: Ion Beam Figuring (IBF) corrective polishing under vacuum
• Working species: Accelerated argon atoms
• Typical precision: down to a few nanometers
• Local resolution: sub-millimeter range
• Mechanics: 6-axis direct drive to maintain ion source orthogonality
• Edge capability: machining up to the surface edge and beyond
• Surface quality capability: λ/200 and better
• Automation: fully automated iterative workflow, high reproducibility
• Aperture changer: up to five diaphragms changeable in vacuum
• Aperture diameter range: 0.5 mm – 20 mm
• Etch-rate measurement: ISERM low-coherence in-situ measurement system
• Measuring hardware: interchangeable sample holder; multiple measurements with a single head
• Software: analysis and visualization of measured data, simulation preparation, customizable GUI