Electronic vacuum coating machine LTE

for electron guns

Overview
The LEYBOLD OPTICS LTE series is a long-throw vacuum coater engineered for nanometer-scale structured features and lift-off metallization. Designed for semiconductor manufacturing and R&D, it delivers directional, near‑perpendicular deposition for high-uniformity patterned films.

Key benefits

• Optimal coating quality: high-precision coatings on structured wafers with minimized shadowing for advanced 3D patterns.
• Service and expertise: access to Leybold Optics/Bühler thin-film know‑how and worldwide service network.
• Flexibility: supports evaporation of metals and oxides, multiple wafer sizes and high material throughput; fully customizable to process needs.

Highlight features

• Advanced long‑throw evaporation geometry with a 1.3 m source-to-dome distance for improved substrate coverage and pattern fidelity.
• Adaptable dome/substrate handling for up to 6 × 150 mm substrates (200 mm option on request).
• Electron‑beam gun combined with plasma source enabling Plasma‑Impulse Atomic Deposition (PIAD) for improved adhesion and thickness control.
• Precision perpendicular deposition system engineered for near‑perpendicular angles to maximize directional coating uniformity.

Lift-off / metallization process

• Physical vapor deposition (PVD)
• Photoresist coating
• Patterned thin‑film deposition
• Metal lift‑off

Applications

• Semiconductor manufacturing
• Microelectronics and optoelectronics
• R&D and pilot production requiring nanometer‑scale patterning

Services & trainings
Installation, process support, maintenance and operator training are available to integrate the LTE series into production and R&D workflows.

Characteristics / technical specifications

• Product family: LEYBOLD OPTICS LTE series
• Technology: long‑throw evaporation (PVD) with support for electron‑beam + plasma (PIAD)
• Source-to-dome distance: 1.3 m
• Substrate capacity: up to 6 × 150 mm (200 mm option upon request)
• Supported wafer sizes: 1–6 inch standard; 8 and 12 inch on request
• Materials: metals (metal lift‑off) and oxides; suitable for high material volumes
• Deposition geometry: near‑perpendicular directional deposition to minimize shadowing
• Main applications: semiconductor manufacturing, micro-/optoelectronics, R&D