Magnetron sputtering machine HELIOS series

for mirrorfor automotive applications

Overview
The HELIOS sputter coater from Bühler is engineered for high-precision thin-film optical coatings used in laser line, steep-edge and notch filters, laser and chirped mirrors, polarizers, beam splitters, bio and ADAS sensors and consumer electronics.

Key benefits

• Superior film properties: optimized film oxidation, high layer densities and low layer losses enabling high laser damage thresholds, low scattering and high reflectivity, supporting filter stacks with >200 layers or total thicknesses up to ~20 µm.
• Outstanding process control: on-substrate in-situ optical monitoring delivers excellent process stability, high production repeatability and thickness precision down to ultra-thin layers.
• PARMS innovation: Plasma-Assisted Reactive Magnetron-Sputtering (PARMS) enables atomic-scale control of very thin layers to increase yield and product grade.

Highlight features

• PARMS combining mid-frequency (MF) and radio-frequency (RF) sputtering via two magnetrons for dielectric coatings from metal targets with high and low refractive indices.
• LEYBOLD OPTICS OMS 5100 on-substrate optical monitoring for precise layer termination and extended unattended operation (test-glass exchange without breaking vacuum for automated loaders).
• Rapid prototyping and transferability: optical designs can be transferred quickly into and between production tools to reduce time-to-market.

Other features / Process capabilities

• Sputtering and co-sputtering for index tuning and high material flexibility; simultaneous use of two sputter stations to achieve intermediate refractive indices.
• Customizable substrate sizes, handling systems and a wide choice of sputter target materials allow configuration to specific product and production requirements.

Applications

• Semiconductor & imaging: imaging and sensing filters, wafer-level optics, AR components, ADAS/LiDAR sensors, hyperspectral imaging.
• Precision optics & telecom: spectral selection, dielectric mirrors, polarizers, beam splitters, narrowband telecom filters.
• Bioimaging & medical: multi-notch and multi-bandpass filters for fluorescence microscopy and medical analysis.

Handling systems (examples)

• Single wafer loader: semi-automatic, compact solution for small-volume production.
• Single cassette loader: automatic loading for medium volumes.
• Multi cassette loader: continuous operation for large volumes with multiple load locks and test-glass storage.
• Wafer direct loader: high-volume direct cassette loading, reduced operator interaction.
• SMIF-pod direct loader: fully automated wafer loading from SMIF pods, ready for AGV/OHT robots (E84).
• HELIOS 1200 FOUP direct loader: FOUP integration with wafer flipper and aligner for high-volume fabs.

More information / Documentation
Brochure and technical data sheets for HELIOS series (HELIOS 800 / HELIOS 1200) are available as product documentation.

Technical specifications

• Technology: Plasma-Assisted Reactive Magnetron-Sputtering (PARMS) combining MF and RF magnetron sputtering.
• On-substrate optical monitoring: LEYBOLD OPTICS OMS 5100 for precise layer termination and high reproducibility.
• Layer capability: supports filter designs with >200 layers or total layer thicknesses up to ~20 µm.
• Material flexibility: sputtering and co-sputtering with wide target choice and index tuning via dual sputter stations.
• Automation: multiple loader options (single wafer, single cassette, multi cassette, wafer direct, SMIF-pod, FOUP direct) for small to large volume production.