Automated wafer bonder EVG®540

The EVG540 automated wafer bonding system is an automated single-chamber production bonder designed for pilot-line manufacturing as well as R&D for high-volume manufacturing in wafer-level packaging, 3D-interconnect and MEMS applications. Based on a modular design, the EVG540 provides a proven solution for future transition of wafer bonding processes from R&D to large-scale manufacturing on our fully integrated production bonding systems. Features Single-chamber bonder up to 300 mm substrate size Compatible with SmartView® and MBA300 Automatic handling of up to four bond chucks Compliant to high safety standards Technical Data Maximum heater size 300 mm Loading chamber 2-axis robot Max. bond chambers 2