PVD deposition machine OPT-E
thin-filmvacuumoptical

PVD deposition machine - OPT-E - GUANGDONG HUASHENG - thin-film / vacuum / optical
PVD deposition machine - OPT-E - GUANGDONG HUASHENG - thin-film / vacuum / optical
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Characteristics

Deposition type
thin-film
Other characteristics
vacuum, optical
Applications
optical lens

Description

Overview
OPT-E is an electron beam optical coating system for depositing optical and functional thin films on glass, quartz, silicon wafers and ceramics. Typical applications include mobile 3D glass, precision optical lenses and semiconductor wafers. The system integrates a deflection electron gun with a water-cooled copper crucible and supports crystal and optical monitoring for accurate multilayer control. Configurable ion-source options are available to enhance film density and adhesion.

Key Benefits
  • Deflection electron gun with water-cooled copper crucible for evaporation of high‑melting‑point metals and oxide ceramics
  • Crystal and optical monitoring for precise thickness and spectral control
  • Ion‑assisted deposition options (RF, hollow cathode, filament Hall) to increase film density and adhesion
  • Flexible dome or planetary carriers enabling continuous multilayer processes (AR, HR, filter coatings)


Features
  • Electron beam evaporation source
  • Crystal and optical monitoring systems for multilayer control
  • Configurable ion‑source types: RF, hollow cathode, filament Hall
  • Workpiece carriers: integrated dome or 4‑axis planetary disc; revolution or planetary rotation with variable‑frequency stepless speed control
  • Touch‑screen interface and PLC automation


Product Parameters
Model: OPT-E
Coating technology: Electron beam evaporation
Working principle: Physical vapour deposition using high‑energy electron beam evaporation
Substrate materials: Glass, quartz, silicon wafers, ceramics
Typical applications: Mobile 3D glass, precision optical lenses, semiconductor wafers
Coating types: AR, HR, optical filter films, semiconductor electrode/contact layers, AF films
Common coating materials: SiO2, TiO2, ZrO2, SiO
Evaporation source: Deflection electron gun with water‑cooled copper crucible
Ultimate vacuum: 6 × 10⁻⁴ Pa (no‑load, clean‑room condition)
Chamber diameter options: Ø900 / Ø1100 / Ø1350 / Ø1550 / Ø1800 / Ø2050 / Ø2350 / Ø2700 mm
Chamber height: 1500 mm
Workpiece carrier: Dome‑shaped carrier / planetary flat disc
Carrier specification: Integrated dome / 4‑axis planetary disc

Technical specifications
  • Model: OPT-E
  • Coating method: Electron beam evaporation (deflection electron gun + water‑cooled copper crucible)
  • Monitoring: Crystal monitoring and optical monitoring for thickness and wavelength control
  • Ion assistance: Configurable RF, hollow cathode or filament Hall ion‑source
  • Supported substrates: Glass, quartz, silicon wafers, ceramics
  • Supported coatings: Anti‑reflective (AR), high‑reflective (HR), optical filters, semiconductor electrode/contact layers, anti‑fingerprint (AF)
  • Common materials: SiO2, TiO2, ZrO2, SiO
  • Vacuum performance: down to 6 × 10⁻⁴ Pa (no‑load, clean‑room conditions)
  • Chamber sizes: diameters Ø900–Ø2700 mm; chamber height 1500 mm
  • Workpiece carriers: Dome or planetary (integrated dome or 4‑axis planetary disc), variable‑frequency speed control
  • Control: Touch‑screen and PLC automation

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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