Critical dimension measuring system SpectraShape™

dimensionalopticalintegrated circuit

Optical Critical Dimension (CD) and Shape Measurement Systems The SpectraShape™ 12k dimensional metrology system is used to fully characterize and monitor the critical dimensions (CD) and three-dimensional shapes of nanosheets, finFETs, DRAM and vertically stacked NAND structures, and other complex features on integrated circuits at leading-edge design nodes. Using significant advancements in optical technologies and patented algorithms, the SpectraShape 12k identifies subtle variations in critical device parameters (critical dimension, high k and metal gate recess, side wall angle, resist height, hardmask height, pitch walking, on-device overlay, etc.) across a range of process layers. With an improved stage and new measurement modules that enable high throughput operation, the SpectraShape 12k provides fast identification of process issues inline, helping fabs accelerate yield ramps and achieve stable production. Applications Inline process monitor, Patterning control, Process window expansion, Process window control, Advanced Process Control (APC), Engineering analysis Related Products AcuShape®: Advanced modeling software that interprets the signals from SpectraShape systems, helping to accelerate the process of building robust, usable 3D shape models. SpectraShape 10K: Optical CD and shape metrology systems enabling measurement of complex features for 1Xnm logic and advanced memory IC devices. SpectraShape 9000: Optical CD and shape metrology systems enabling measurement of complex features for IC devices at the 20nm and below design nodes.