Surface defect inspection system Teron™ 600

for production

The Teron™ 640e reticle inspection product line advances the development and qualification of leading-edge EUV and 193nm patterned reticles in mask shops by detecting critical pattern and particle defects. Using die-to-database or die-to-die modes, these inspection systems are designed to handle the wide range of stack materials, curvilinear and complex OPC structures characteristic of the latest 2nm and beyond device nodes. The Teron™ 647eS2 incorporates several optics and image processing enhancements that support the defect capture specifications and throughput required to accelerate reticle manufacturing cycle times. Additionally, Teron 647eS2 uses the second-generation deep learning AI algorithm, X30, validated in 2nm customer production. The Teron 640e product line achieves the stringent cleanliness requirements necessary for production of EUV masks. Field upgrades to Teron 647eS2 are available for Teron 647e and Teron™ 647eS models. Applications Reticle qualification, Reticle process control, Reticle process equipment monitoring, Outgoing reticle quality check Related Products Teron 640: Industry production standard for inspection of optical and EUV reticles at the 10nm node and beyond. Teron 630: Industry production standard for inspection of 1Xnm / 2XHP optical and EUV reticles. Teron 610: Industry production standard for inspection of 2Xnm / 3XHP optical reticles. TeraScan™ 500XR: Industry production standard for inspection of 3Xnm / 4XHP optical reticles.