Optical inspection system Teron™ SL600

automaticsurface defectfor wafers

The Teron™ SL670e XP2 inspection system is used to assess incoming EUV reticle quality and to re-qualify EUV reticles periodically during production use and after reticle cleaning, helping chipmakers protect yield by reducing the risk of printing defective wafers. With innovative EUVGold™ and EUVMultiDie technologies, advanced focus tracking, and imaging flexibility, the Teron SL670e XP2 delivers the sensitivity required to monitor and detect yield-critical reticle defects on EUV reticles used for 2nm logic and advanced DRAM chip production. The Teron SL670e XP2 also has industry-leading production throughput, supporting the fast cycle times needed to qualify reticles during high-volume chip manufacturing. Inspection of advanced optical reticles is supported on the Teron SL670e XP2 with an option. Reticle re-qualification, Incoming reticle quality check Inspection of EUV and optical (optional) reticles during chip manufacturing for 7nm/5nm design node IC technologies. Reticle data analytics system for IC fabs supports applications such as automatic defect classification, lithography plane review and defect progression monitoring. Inspection of optical and EUV (optional) reticles during chip manufacturing for 10nm design node IC technologies. Inspection of optical reticles during chip manufacturing for 20nm design node IC technologies.