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... High Productivity Patterned Wafer Broad Range Inspection Systems The 8 Series patterned wafer inspection systems detect a wide variety of defect types at very high throughput for fast ...
KLA Corporation
... The eSL10™ electron-beam (e-beam) patterned wafer defect inspection system leverages the industry’s highest landing energy and high resolution to capture small physical and high aspect ratio defects, supporting process ...
KLA Corporation
... production standard for inspection of optical and EUV reticles at the 10nm node and beyond. Teron 630: Industry production standard for inspection of 1Xnm / 2XHP optical and EUV reticles. Teron 610: Industry production ...
KLA Corporation
... The Teron™ SL670e XP2 inspection system is used to assess incoming EUV reticle quality and to re-qualify EUV reticles periodically during production use and after reticle cleaning, helping chipmakers protect yield by ...
KLA Corporation
... blank defect inspection system supports mask shops and blank manufacturers in meeting mask blank defect requirements for optical and EUV lithography applications. The FlashScan 211 system pairs its high ...
KLA Corporation
... nuisance. The latest Kronos 1190XR system provides eXtended Range by handling a broader range of wafer thicknesses. Supporting bonded, thinned, warped and diced substrates, the system enables cost-effective defect inspection ...
KLA Corporation
... provides production-proven process control and monitoring strategies for Cu-pillars, bumps, through silicon vias (TSVs), redistribution layer (RDL), hybrid bonding and other packaging process flows. The latest CIRCL-AP system ...
KLA Corporation
... Packaged IC Inspection and Metrology Systems The ICOS™ T890 component inspector provides high-performance, fully automated optical inspection of packaged integrated circuit (IC) components. It leverages ...
KLA Corporation