The No.5971 butyl tape for processing features improved die-cutting performance, enabling increased processing efficiency. It is suitable for adhesive bonding of multiple substrates in industrial converting and assembly operations.
Applications and features
Adhesive processing of various materials (rubber sheets, foam, nonwoven, metal foils)
Good waterproofing and vibration-damping properties
Thickness: 1 mm
Structure
Layered construction as shown on the product page (structure image provided)
General property
Adhesion (N/10mm): 1st surface 10.00; 2nd surface 10.00
Tack: Ball No. 50
Holding power (drop): 400 min
Test method: according to SLIONTEC method
Holding power condition: 23C, 4.9 N
Functions / Environmental
Removable paper core — enables use to the end and reduces waste
Environmentally sensitive adhesive composition — solvent-free and free from toluene/xylene
Characteristics / Technical specifications
Model: No.5971
Product type: Butyl tape for processing
Thickness: 1 mm
Removable paper core
Adhesive: solvent-free, free from toluene/xylene
Common instructions for application
Clean surfaces from dirt, dust and oils before application
Apply sufficient pressure to the tape after placement to obtain required adhesion
Store in a cool, dark place; avoid direct sunlight and heat sources
Not for electrical insulation purposes
Do not apply directly to furniture, walls, glass, PVC products, vehicle bodies, etc. — adhesive residues, discoloration or paint peeling may occur
Do not apply directly to skin unless tape is intended for skin contact — may cause irritation or adhesive deposition
Select tape carefully to avoid residue or contamination of substrates
Provided values are measured data but are not guaranteed
Production lead times and specifications may change without prior notice
Use with caution; SLIONTEC does not accept liability for damage resulting from tape use