3D profilometer surfaceCONTROL 3D 3560

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Overview
The surfaceCONTROL 3D 3560 is a fully integrated all‑in‑one 3D snapshot sensor platform for inline production inspection. It captures full‑field 3D measurements with very high data density and precision, providing short acquisition and evaluation times and flexible data output modes (SMART and 3D DATA).

Key features

• Very high precision: Z‑axis repeatability down to 0.25 µm
• Fast 3D acquisition from 0.2 s for short production cycle times
• High data density: more than 10 million 3D points per measurement
• SMART all‑in‑one system: sensor, on‑sensor evaluation and software in a single device
• Direct measurement‑value output for inline automation
• Industrial interfaces for easy machine integration

SMART and 3D DATA modes
SMART mode: Integrated evaluation runs directly in the sensor controller. Measurement programs created in 3DInspect are stored on the sensor and executed without an external evaluation unit, allowing direct OK/NOK decisions and numeric outputs to the production process.

3D DATA mode: The sensor outputs complete, calibrated 3D point‑clouds for high‑resolution processing in customer software via Gigabit Ethernet and the Micro‑Epsilon 3D SDK.

Fieldbus / Integration
The sensor supports common industrial fieldbusses and automation interfaces for direct machine integration: PROFINET, EtherCAT and EtherNet/IP. Measurement values and evaluations can be transmitted directly to machine controllers for inline automation.

Measuring fields (models / typical ranges)
SC3560-30-IE — Z max. 130 ±6 mm; XY max. 30.5 mm × 19.0 mm
SC3560-80-IE — Z max. 130 ±20 mm; XY max. 77.5 mm × 52 mm
SC3560-120-IE — Z max. 206 ±35 mm; XY max. 123.5 mm × 80 mm
SC3560-240-IE — Z max. 440 ±100 mm; XY max. 245 mm × 170 mm

Applications / Examples

• Full‑field flatness measurement (e.g. charging connectors)
• Detection of smallest height differences on PCBs and fine geometries
• Defect detection on automotive body components
• Inline quality control and robot‑assisted inspection tasks

Technical specifications

• Z‑axis repeatability: down to 0.25 µm
• Lateral resolution: up to approx. 8 µm (model dependent)
• Acquisition time: from approx. 0.2 s (dependent on mode and field)
• Data density: >10 million 3D points per measurement
• Operating modes: SMART (on‑sensor evaluation) and 3D DATA (full calibrated point cloud)
• Integrated software: measurement programs via 3DInspect; execution on sensor controller
• Interfaces: PROFINET, EtherCAT, EtherNet/IP, Gigabit Ethernet
• SDK: Micro‑Epsilon 3D Sensor SDK for customer integration
• Available variants: SC3560-30-IE, SC3560-80-IE, SC3560-120-IE, SC3560-240-IE