Focal plane array image sensor RSS101M1

InGaAsSWIRinfrared

Product Overview
The RSS101M1 is a digital short‑wave infrared (SWIR) InGaAs focal plane detector featuring a 1280×1024 area array and 10µm pixel pitch. It supports high‑speed ROI windowing and uses a hermetically sealed metal package with an integrated single‑stage TEC for active temperature control. Designed for demanding imaging tasks, the detector offers low noise, low power consumption and a large format suitable for industrial and scientific applications.

Key Features

• Pixel Pitch: 10µm
• Area Array Size: 1280×1024
• Maximum Frame Rate (Full Window): 60fps
• Integration Type: Global shutter
• Minimum Integration Time: 1µs
• Readout Noise (Typical): 45e@20°C (high gain mode)
• Optional Gain: 3‑level
• Packaging: Hermetically sealed metal package with built‑in single‑stage TEC
• Operating Power Consumption: ≤350mW
• Outline Dimensions: 32.0×23.5×7.0mm³ (excluding pin size)
• Device Weight: 28±2g

Applications

• Visual enhancement and outdoor night vision
• Machine vision and process/defect inspection
• Photovoltaic cell inspection
• Space remote sensing and scientific imaging

Technical Specifications
Sensor: InGaAs
Spectral Response Range: 0.9µm – 1.7µm
Quantum Efficiency: >70% (1.0µm–1.6µm)
Optical Fill Factor: 100%
Pixel Pitch: 10µm
Area Array Size: 1280×1024
Effective Pixel Rate: ≥99.8%
Maximum Frame Rate (Full Window): 60fps
Integration Type: Global shutter
Minimum Integration Time: 1µs
Readout Noise (Typical): 45e@20°C (high gain mode)
Optional Gain: 3‑level
Average Pixel Dark Current: ≤90ke/s@20°C
Operating Power Consumption: ≤350mW
Effective Data Output Bit Depth: 13bit
Dynamic Range: ≥48dB
Response Non‑uniformity: ≤5% (non‑corrected)
Packaging Type: Hermetically sealed metal package (built‑in single‑stage TEC)
Outline Dimensions: 32.0×23.5×7.0mm³ (excluding pin size)
Device Weight: 28±2g
Operating Case Temperature: -40°C – +65°C
Storage Case Temperature: -45°C – +70°C