Infrared line sensor RL01K1-C0
for general purposesindustrialhigh-resolution

Infrared line sensor - RL01K1-C0 - Raythink Technology Co., Ltd. - for general purposes / industrial / high-resolution
Infrared line sensor - RL01K1-C0 - Raythink Technology Co., Ltd. - for general purposes / industrial / high-resolution
Infrared line sensor - RL01K1-C0 - Raythink Technology Co., Ltd. - for general purposes / industrial / high-resolution - image - 2
Infrared line sensor - RL01K1-C0 - Raythink Technology Co., Ltd. - for general purposes / industrial / high-resolution - image - 3
Infrared line sensor - RL01K1-C0 - Raythink Technology Co., Ltd. - for general purposes / industrial / high-resolution - image - 4
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Characteristics

Technology
infrared
Applications
industrial, for general purposes
Other characteristics
high-resolution, high-speed, compact, high-sensitivity

Description

Description
The RL01K1-C0 short-wave infrared (SWIR) linear array detector is based on InGaAs sensor technology and offers a 1024×1 format with 12.5µm pixel pitch. Packaged in a TECless ceramic PGA, it is designed for high-resolution, high line-rate acquisition with low noise and optimized SWaP for industrial imaging and spectroscopy applications.

Features
  • Pixel Pitch: 12.5µm
  • Area Array Size: 1024×1
  • Operating Power Consumption: ≤200mW
  • Outline Dimensions: 28.91×18.64×4.0mm3 (excluding pin size)
  • Device Weight: 8±2g


Applications
  • Agricultural product sorting
  • Resource recycling
  • Industrial sorting
  • Photovoltaic inspection
  • Machine vision


Technical specifications
  • Sensor: InGaAs
  • Spectral Response Range: 0.9µm – 1.7µm
  • Quantum Efficiency: >70% (1.0µm – 1.6µm)
  • Optical Fill Factor: 100%
  • Pixel Pitch: 12.5µm
  • Area Array Size: 1024×1
  • Effective Pixel Rate: >99.8%
  • Maximum Output Line Frequency: 36kHz
  • Readout Mode: ITR, IWR
  • Minimum Integration Time: 15µs
  • Readout Noise (Typical): ≤50e@1-36kHz, 20°C
  • Optional Gain: ≥4-level
  • Average Pixel Dark Current: ≤100ke/s@20°C
  • Operating Power Consumption: ≤200mW
  • Output Signal Swing: 1.9±0.1V
  • Dynamic Range: ≥58dB
  • Response Non-uniformity: ≤5%, non-corrected
  • Packaging Type: PGA ceramic packaging (TECless)
  • Outline Dimensions: 28.91×18.64×4.0mm3 (excluding pin size)
  • Device Weight: 8±2g
  • Operating Case Temperature: -20°C – +50°C
  • Storage Case Temperature: -40°C – +60°C

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Exhibitions

Meet this supplier at the following exhibition(s):

INTERSCHUTZ 2026
INTERSCHUTZ 2026

1-06 Jun 2026 HANNOVER (Germany)

  • More information
    Sensor+Test 2026
    Sensor+Test 2026

    9-11 Jun 2026 Nürnberg (Germany)

  • More information
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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.