PCIe AI inference acceleration card M.2 Axelera AIPU

embeddedvision processingdeep learning

Overview
This compact M.2 AI acceleration module integrates the METIS AI processor (Axelera AIPU), delivering up to 214 TOPS for edge AI inference. Designed for industrial and embedded edge applications, the module provides up to 2 GB of onboard AIPU RAM, PCIe Gen3 x4 connectivity and a 22×80 mm (M.2 2280) form factor with integrated thermal dissipation. The B+M key interface ensures broad compatibility with embedded carrier boards and industrial systems. Typical use cases include computer vision, predictive maintenance and real-time intelligent automation.

Highlights

• Form factor: M.2 2280 (22×80 mm) with integrated thermal dissipation
• Processor: METIS AI processor (Axelera AIPU) — up to 214 TOPS
• Memory: AIPU memory up to 2 GB
• Interface: PCIe Gen3, up to x4 lanes; B+M key compatibility
• Variants: M key option and M.2 2260 available on request

Security & Software Features

• Secure boot and root of trust to ensure system integrity from first startup
• OTA updates for remote and secure software distribution
• Continuous device monitoring for status and activity
• Yocto-based secure OS integration for customizable, industrial-grade builds
• Container support (Docker) for isolated application deployment
• Certified security compliance (EN18031-1)

Part Numbers

• EE85-1110-0000-C0 — IC FLASH 16Mbit SPI/QUAD 8U SON
• EE85-1120-0000-C0 — IC FLASH 512Mbit SPI/QUAD 8W SON

Technical specifications

• CPU description: M.2 2280 – M key with 1× Metis AIPU (M.2 2260 option available)
• Memory description: AIPU memory up to 2 GB
• PCI description: PCIe Gen3 x4 lanes
• Security: Secure boot; root of trust
• Power supply: 3.5–9 W
• Operating temperature: Commercial 0°C to +60°C; Industrial −40°C to +85°C (actual range depends on application/enclosure)
• Form factor: M.2 2280 (22×80 mm); B and B+M/M key compatibility
• AI performance: up to 214 TOPS (METIS)
• Integrated thermal dissipation solution
• Recommended: evaluate system-level cooling and enclosure design for target application