Automated XYZ inline wafer inspection with large sample capacity
This inspection system is specially designed for automated quality control of large and flat carrier up to 50 kg. The positioning system allows simultaneous positioning of sensor in Z and specimen in XY on a very compact footprint. The robust system also allows the use of heavy sensors or camera systems up to 20 kg in Z. The spindle drive, in combination with a spindle brake, guarantees optimum self-holding, so that a vertical position can be maintained in the de-energized state. The low-emission all-round enclosed system is also suitable for harsh industrial environments under dust and smoke. A suspension system has been attached to the granite for cable routing.
Compact design with optimized price/performance ratio
• Ideal for surface inspection of large carriers up to 650 x 650 mm
• Precise measurement with repeatability up to 2 µm
• Good price-performance ratio due to drive with stepper motor
• Strong and robust Z-axis for sensors, microscopes and cameras up to 20 kg
• Suitable for industrial environments e.g. dust, smoke
Optionally expandable:
• Various travels up to 1000 mm
• With/without frame and base plate made of granite or aluminum
• Versions ISO 14644-1 (up to class 1 on request) e.g. with enclosure and with exhaust system
• Individual solutions for cable routing
• Adapted vibration decoupling by means of damping rubber layer or pneumatic dampers
• Immediate use with pre-configured controller incl. exemplary software