Automatic wire bonder HB100

Automatic Wire Bonder With motorized Z-Y-X Axes and Bond Head Rotation The motorized Z-Y-X Axes and the rotatable Bond Head are the key to configure, safe and execute automatic Bond processes. Option Pattern Recognition Teaser Bonding with TPT's automatic Wire Bonder HB100: Pattern Recognition and automatic bonding a series of chips on different substrates. One Bond Head for Wedge, Ball, Bump, & Ribbon With our machines there is no need to change the bond head, no matter the application. Just switch tool tips, fast and easy. All bonding modes are at your disposal any time. Workspace very large for bigger cases or multiple substrates Big or unusual substrates and cases will have more then enough space on our HB100. Even better, combine it with one of our larger heater stages.