Optical inspection system TR7007Q/QI Plus series

camera3DEtherCAT

Introduction
The TR7007Q/QI Plus is a 3D solder paste inspection (SPI) system designed for PCB production lines. It combines EtherCAT motion control and enhanced 2D lighting to inspect low solder bridges, compensate board warpage and support up to 4 projectors to reduce shadowing. The platform integrates with MES systems to provide production data traceability and real‑time SPC.

Key features

• Enhanced 2D lighting (RGB+W) with up to 4 projectors for reduced shadow effects
• EtherCAT motion controller for synchronized, real-time measurements
• Smart Factory integration with real-time SPC trends and Closed-Loop readiness
• Camera options and selectable imaging resolutions for process flexibility

Optical system
Imaging method: Stop-and-Go Imaging
Camera: 4 Mpix or 12 Mpix (factory setting)
Imaging resolution: 5.5 μm, 6 μm, 10 μm, 12 μm, 15 μm (factory setting)
Lighting: Enhanced 2D Lights (RGB+W)
3D technology: 4-way Digital Fringe Pattern
Field of view (examples): 4 MP Camera Link @10 μm: 20.3x20.3 mm; @15 μm: 30.5x30.5 mm; 12 MP Camera Link @5.5 μm: 22.5x16.5 mm; @10 μm: 40.6x30.7 mm; @15 μm: 61x46 mm; 12 MP CoaXPress @6 μm: 24.3x18.4 mm; @10 μm: 40.6x30.7 mm; @12 μm: 48.7x36.8 mm; @15 μm: 61x46 mm

Inspection performance
Imaging speed: 4 MP Camera Link: up to 3 FOV/sec; 12 MP Camera Link: up to 1.8 FOV/sec; 12 MP CoaXPress: up to 2.6 FOV/sec
Height resolution: 0.22 μm (@5.5/6 μm) or 0.45 μm (@10/15 μm)
Max. solder height (on calibration target): up to 750 μm (depends on resolution)

Motion table & control
X/Y/Z axis control: Ballscrew + EtherCAT motion controller
X-Y axis resolution: 0.1 μm
Z-axis resolution: 0.1 μm

Board handling
Max PCB size (examples): TR7007Q/QI Plus @5.5 μm, 6 μm: 400 x 330 mm; @10/12/15 μm: 510 x 460 mm
TR7007Q/QI Plus DL: 510 x 310 mm x 2 lanes; 510 x 590 mm x 1 lane
TR7007LQ Plus: up to 765 x 610 mm (select variants)
PCB thickness: 0.5 - 6 mm
Max PCB weight: 3 kg (optional 5 kg)
Top clearance: 25 mm (@5.5/6 μm) or 50 mm (@10/12/15 μm); Bottom clearance: 40 mm; Edge clearance: 3 mm
Conveyor height: 880–920 mm (SMEMA compatible)

Inspection functions
Defects detected: insufficient paste, excessive paste, shape deformity, missing paste, bridging
Measurements: height, area, volume, offset

Dimensions & weight
WxDxH (examples): TR7007Q Plus: 1000 x 1400 x 1650 mm; TR7007Q Plus DL: 1000 x 1500 x 1650 mm; TR7007LQ Plus: 1365 x 1720 x 1710 mm; TR7007QI Plus: 1000 x 1360 x 1600 mm; TR7007QI Plus DL: 1000 x 1717 x 1600 mm
Weight (examples): TR7007Q Plus: 775 kg; TR7007Q Plus DL: 825 kg; TR7007LQ Plus: 982 kg; TR7007QI Plus: 775 kg; TR7007QI Plus DL: 825 kg

Technical specifications

• Model: TR7007Q/QI Plus
• Imaging method: Stop-and-Go Imaging
• Camera options: 4 Mpix or 12 Mpix (factory setting)
• Available imaging resolutions: 5.5 μm, 6 μm, 10 μm, 12 μm, 15 μm
• Lighting: Enhanced 2D Lights (RGB+W); up to 4 projectors
• 3D tech: 4-way Digital Fringe Pattern
• Height resolution: 0.22 μm (5.5/6 μm) or 0.45 μm (10/15 μm)
• Motion control: Ballscrew + EtherCAT (X/Y/Z)
• X-Y-Z resolution: 0.1 μm
• PCB thickness support: 0.5 - 6 mm
• Conveyor height: 880–920 mm (SMEMA compatible)
• Defect coverage and measurements: paste volume/area/height, offset, bridging detection