Optical inspection machine TR7007D/DI Plus series

3DPCBfor the electronics industry

Introduction
The TR7007D/DI Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007D/DI Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007D/DI Plus is equipped with two projectors to ensure seamless shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.

Features

• Enhanced 2D Lighting for higher uniformity inspection.
• New motion controller, EtherCAT, for real-time measurements.
• Smart Factory solution with Real-time SPC Trends.
• Closed Loop Ready: Feedback and Feedforward Capabilities.

Optical System
Imaging Method: Stop-and-Go Imaging
Camera: 4 Mpix or 12 Mpix (factory setting)
Imaging Resolution: 5.5 μm, 6 μm, 10 μm, 12 μm, 15 µm (factory setting)
Lighting: Enhanced 2D Lights (RGB+W)
3D Technology: 2-way Digital Fringe Pattern
Field of View:
4 MP Camera Link - @ 10 μm: 20.3x20.3 mm @ 15 μm: 30.5x30.5 mm
12 MP Camera Link - @ 5.5 μm: 22.5x16.5 mm @ 10 μm: 40.6x30.7 mm @ 15 μm: 61x46 mm
12 MP CoaXPress - @ 6 μm: 24.3x18.4 mm @ 10 μm: 40.6x30.7 mm @ 12 μm: 48.7x36.8 mm @ 15 μm: 61x46 mm

Inspection Performance
Imaging Speed: 4 MP Camera Link: Up to 3 FOV/sec; 12 MP Camera Link: Up to 1.8 FOV/sec; 12 MP CoaXPress: Up to 2.6 FOV/sec
Height Resolution: @10 μm/15 μm: 0.45 μm; @5.5 μm/6 μm: 0.22 μm
Max. Solder Height: @10 μm/15 μm: 420 μm/750 μm; @5.5 μm/6 μm: 210 μm/310 μm (on Calibration Target)

Motion Table & Control
X-Axis Control: Ballscrew + EtherCAT motion controller
Y-Axis Control: Ballscrew + EtherCAT motion controller
Z-Axis Control: Ballscrew + EtherCAT motion controller
X-Y Axis Resolution: 0.1 μm
Z-Axis Resolution: 0.1 μm

Board Handling
Max PCB Size: TR7007D/DI Plus: @5.5 μm, 6 μm - 400 x 330 mm; @10, 12, 15 μm - 510 x 460 mm
TR7007D/DI Plus DL: @10, 12, 15 μm - 510 x 310 mm x 2 Lanes, 510 x 590 mm x 1 Lane
TR7007LD Plus: @6 μm, 10 μm, 15 μm - 765 x 610 mm
PCB Thickness: 0.5 - 6 mm
Max PCB Weight: 3 kg (Optional: 5 kg)
Top Clearance: @5.5 μm, 6 μm: 25 mm; @10 μm, 12 μm, 15 μm: 50 mm
Bottom Clearance: 40 mm
Edge Clearance: 3 mm
Conveyor Height: 880 – 920 mm (SMEMA Compatible)

Inspection Functions
Defects: Insufficient Paste; Excessive Paste; Shape Deformity; Missing Paste & Bridging
Measurement: Height; Area; Volume; Offset

Dimensions
WxDxH:
TR7007D Plus: 1000 x 1400 x 1650 mm
TR7007D Plus DL: 1000 x 1500 x 1650 mm
TR7007LD Plus: 1365 x 1720 x 1710 mm
TR7007DI Plus: 1000 x 1360 x 1600 mm
TR7007DI Plus DL: 1000 x 1717 x 1600 mm
Note: not including signal tower (signal tower height 515 mm)
Weight:
TR7007D Plus: 775 kg; TR7007D Plus DL: 825 kg; TR7007LD Plus: 982 kg
TR7007DI Plus: 775 kg; TR7007DI Plus DL: 825 kg

Caractéristiques / spécifications techniques

• Model: TR7007D/DI Plus
• Imaging Method: Stop-and-Go Imaging
• Camera options: 4 Mpix or 12 Mpix (factory setting)
• Imaging Resolutions available: 5.5 μm, 6 μm, 10 μm, 12 μm, 15 μm
• Lighting: Enhanced 2D Lights (RGB+W)
• 3D Technology: 2-way Digital Fringe Pattern (dual projectors for shadow-free inspection)
• Motion Control: Ballscrew + EtherCAT motion controller (X/Y/Z)
• X-Y / Z Axis Resolution: 0.1 μm
• Height Resolution: 0.22 μm (at 5.5/6 μm) / 0.45 μm (at 10/15 μm)
• Max Solder Height (on calibration target): up to 750 μm depending on resolution
• Max PCB Size (typical): up to 510 x 460 mm (varies by configuration)
• PCB Thickness: 0.5 - 6 mm
• Max PCB Weight: 3 kg (optional 5 kg)
• Conveyor Height: 880 – 920 mm (SMEMA compatible)
• Inspection capabilities: paste defects detection and measurements (height, area, volume, offset)