Optical inspection machine TR7007Q SII series

3DPCBfor the electronics industry

Introduction
The TR7007Q SII is a 3D solder paste inspection (SPI) system engineered for high-throughput SMT production. Its high-speed platform provides up to 50% faster inspection versus previous models, delivering improved measurement accuracy and process stability. The system supports Wide Spectrum lighting and optional coaxial illumination to enhance contrast and defect detection. TR7007Q SII is Industry 4.0 ready and supports IPC CFX and IPC Hermes 9852 protocols.

Features

• Wide Spectrum Light for enhanced contrast and detection rate
• Improved accuracy and stability for precise solder measurements
• New EtherCAT motion controller for real-time motion control
• 100% shadow-free quad/dual digital fringe projectors
• SmartWarp compensation to eliminate local PCB deformation
• Smart Factory solution with real-time SPC trend monitoring
• Closed-loop ready with feedback and feed-forward capabilities

Optical System
Imaging Method: Stop-and-Go Imaging
Camera: 21 Mpix or 25 Mpix (factory setting)
Imaging Resolution: 9.8 μm, 10 μm, 12 μm, 15 μm (factory setting)
Lighting: Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting (optional)
3D Technology: 4-way Digital Fringe Pattern
Field of View:
- 9.8 μm: 50.30 x 40.24 mm
- 10 μm: 51.2 x 51.2 mm
- 12 μm: 62.97 x 50.38 mm
- 15 μm: 76.8 x 61.4 mm

Inspection Performance
Imaging Speed: 2.3 FOV/sec
Height Resolution:
- 9.8 μm: 0.4 μm
- 10 μm: 0.45 μm
- 12 μm: 0.45 μm
- 15 μm: 0.454 μm
Max. Solder Height (on Calibration Target):
- 9.8 μm: 420 μm
- 10 μm: 420 μm
- 12 μm: 420 μm
- 15 μm: 470 μm

Motion Table & Control
X-Axis Control: Ballscrew + AC Servo with EtherCAT Motion Controller
Y-Axis Control: Ballscrew + AC Servo with EtherCAT Motion Controller
Z-Axis Control: Ballscrew + AC Servo with EtherCAT Motion Controller
X-Y Axis Resolution: 0.1 μm
Z-Axis Resolution: 0.1 μm

Board Handling
Max PCB Size:
- TR7007Q SII: 510 x 460 mm
- TR7007MQ SII: 660 x 610 mm (optional: 660 x 690 mm)
- TR7007Q SII DL: 510 x 310 mm x 2 Lanes, 510 x 590 mm x 1 Lane
- TR7007LQ SII: 765 x 610 mm
PCB Thickness: 0.5 - 6 mm
Max PCB Weight:
- TR7007MQ SII / TR7007Q SII (DL): 3 kg (optional: 5 kg)
- TR7007LQ SII: 3 kg (optional: 5 kg / 12 kg)
Top Clearance:
- TR7007Q SII (DL): 25 mm
- TR7007MQ SII / TR7007LQ SII: 50 mm
Bottom Clearance: 40 mm
Edge Clearance: 3 mm (optional: 4 mm / 5 mm)
Conveyor Height: 880 - 920 mm (optional: 940 - 965 mm)
* SMEMA Compatible

Inspection Functions
Defects detected:

• Insufficient paste
• Excessive paste
• Shape deformity
• Missing paste & bridging

Measurement capabilities:

• Height
• Area
• Volume
• Offset

Dimensions
WxDxH:
- TR7007Q SII: 1000 x 1480 x 1710 mm
- TR7007MQ SII: 1250 x 1740 x 1710 mm
- TR7007Q SII DL: 1000 x 1750 x 1710 mm
- TR7007LQ SII: 1365 x 1720 x 1710 mm
Note: not including signal tower
Weight:
- TR7007Q SII: 795 kg
- TR7007MQ SII: 992 kg
- TR7007Q SII DL: 840 kg
- TR7007LQ SII: 1025 kg

Inspection Functions (summary)
Component / solder capabilities: measurement of solder height, area, volume, offset; detection of insufficient/excessive/missing/bridging paste and shape deformities.

Technical Specifications

• Model: TR7007Q SII
• Imaging Method: Stop-and-Go Imaging
• Camera: 21 Mpix or 25 Mpix (factory setting)
• Imaging Resolution options: 9.8 μm, 10 μm, 12 μm, 15 μm
• Lighting: Wide Spectrum 2D Lights (RGB+W); Coaxial Lighting (optional)
• 3D Tech: 4-way Digital Fringe Pattern; 100% shadow-free quad/dual digital fringe projectors
• Field of View by resolution: 9.8 μm = 50.30 x 40.24 mm; 10 μm = 51.2 x 51.2 mm; 12 μm = 62.97 x 50.38 mm; 15 μm = 76.8 x 61.4 mm
• Imaging Speed: 2.3 FOV/sec
• Height Resolution: down to 0.4 μm (9.8 μm setting)
• Max Solder Height (calibration target): up to 470 μm (15 μm setting)
• Motion control: Ballscrew + AC Servo on X/Y/Z with EtherCAT motion controller
• X-Y / Z resolution (motion): 0.1 μm
• PCB handling sizes & options: multiple variants (Q, MQ, Q DL, LQ)
• PCB Thickness range: 0.5 - 6 mm
• Conveyor height: 880 - 920 mm (optional 940 - 965 mm)
• Clearances: Top (25 mm for DL / 50 mm for MQ & LQ), Bottom 40 mm, Edge 3 mm (optional up to 5 mm)
• Max PCB Weight: base 3 kg (optional 5 kg / 12 kg depending on model)
• Dimensions (WxDxH) and weights per model listed above
• Defect detection: insufficient/excessive paste, shape deformity, missing paste, bridging
• Measurement outputs: height, area, volume, offset
• Industry 4.0 readiness: supports IPC CFX and IPC Hermes 9852 standards