Optical inspection system TR7007 SIII series

camera3DEtherCAT

Introduction
The TR7007 SIII is an automated optical inspection (AOI) system designed for high-speed, high-precision PCB inspection. Built on an enhanced mechanical platform, it provides stability and repeatability for inline production inspection. The system supports Industry 4.0 standards including IPC Connected Factory Exchange (CFX) and IPC Hermes 9852.

Features

• Inspection speed up to 200 cm²/s (4 Mpix @15 µm)
• Smart Programming for rapid setup — ready to inspect in minutes
• Suitable for telecom, consumer electronics and other SMT applications
• Closed-loop ready with feedback and feedforward capabilities
• Smart factory integration with real-time SPC trend reporting

Optical System
Imaging Method: Dynamic Imaging
Camera: 4 Mpix
Imaging Resolution: 10 µm, 15 µm (factory setting)
Lighting: Wide Spectrum 2D Lights (RGB+W)
3D Technology: 2-way Fringe Pattern
Field of View: 20 x 20 mm (@10 µm) / 30 x 30 mm (@15 µm)

Inspection Performance
Imaging Speed: 90 cm²/s (@10 µm) / 200 cm²/s (@15 µm)
Height Resolution: 0.4 µm
Max. Solder Height: 400 µm (@10 µm) / 385 µm (@15 µm)

Motion Table & Control
X-Axis Control: Linear motor + Linear Scale + EtherCAT Servo
Y-Axis Control: AC motor with ball screw + EtherCAT Servo
Z-Axis Control: AC motor with ball screw + EtherCAT Servo
X-Y Axis Resolution: 0.5 µm
Z-Axis Resolution: 1 µm

Board Handling
Max PCB Size: TR7007 SIII: 510 x 460 mm; TR7007M SIII: 660 x 610 mm; TR7007 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness: 0.5–6 mm
Max PCB Weight: 3 kg (Optional: 5 kg)
Top Clearance: 25 mm
Bottom Clearance: 40 mm
Edge Clearance: 3 mm (Optional: 4 mm / 5 mm)
Conveyor Height: 880–920 mm (SMEMA Compatible)

Inspection Functions
Defects: Insufficient Paste; Excessive Paste; Shape Deformity; Missing Paste & Bridging
Measurement: Height; Area; Volume; Offset

Dimensions
WxDxH: TR7007 SIII: 1100 x 1480 x 1600 mm; TR7007M SIII: 1250 x 1740 x 1710 mm; TR7007 SIII DL: 1100 x 1705 x 1600 mm (excluding signal tower)
Weight: TR7007 SIII: 740 kg; TR7007M SIII: 991 kg; TR7007 SIII DL: 925 kg

Technical specifications

• Model: TR7007 SIII
• Imaging Method: Dynamic Imaging
• Camera: 4 Mpix
• Imaging Resolution: 10 µm, 15 µm (factory setting)
• Lighting: Wide Spectrum 2D Lights (RGB+W)
• 3D Technology: 2-way Fringe Pattern
• Field of View: 20 x 20 mm (@10 µm) / 30 x 30 mm (@15 µm)
• Imaging Speed: 90 cm²/s (@10 µm) / 200 cm²/s (@15 µm)
• Height Resolution: 0.4 µm
• Max Solder Height: 400 µm (@10 µm) / 385 µm (@15 µm)
• X-Y Resolution: 0.5 µm; Z Resolution: 1 µm
• X-Axis Control: Linear motor + Linear Scale + EtherCAT Servo
• Y/Z-Axis Control: AC motor with ball screw + EtherCAT Servo
• Max PCB Size: 510 x 460 mm (standard); other variants as listed above
• PCB Thickness: 0.5–6 mm
• Max PCB Weight: 3 kg (optional 5 kg)
• Conveyor Height: 880–920 mm (SMEMA Compatible)
• Overall Dimensions (WxDxH): 1100 x 1480 x 1600 mm (standard model)
• Weight: 740 kg (standard model)