Digital inspection system TR7007D SII series

camera3DEtherCAT

Introduction
The TR7007D SII is a 3D solder paste inspection (SPI) system built for high-speed, high-precision SMT production lines. The platform delivers up to 50% faster inspection throughput versus previous models while improving measurement stability and reducing false calls. Wide Spectrum 2D lighting and optional coaxial illumination increase contrast and defect detectability for fine features. The system is Industry 4.0 ready and supports IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 (optional).

Features

• Wide Spectrum Light (RGB+W) for improved contrast and detection rate
• Enhanced measurement accuracy and stability for precise solder metrics
• EtherCAT motion controller for real-time synchronized measurements
• 100% shadow-free dual digital fringe projectors
• SmartWarp compensation to correct local PCB deformation
• Smart Factory functions with real-time SPC trend visualization
• Closed-loop ready: feedback and feed-forward process control

Optical System
Imaging method: Stop-and-Go Imaging
Camera: 21 Mpix or 25 Mpix (factory setting)
Imaging resolution options: 9.8 μm, 10 μm, 12 μm, 15 μm (factory setting)
Lighting: Wide Spectrum 2D lights (RGB+W); Coaxial lighting optional
3D technology: 2-way Digital Fringe Pattern
Field of view by resolution:
9.8 μm: 50.30 x 40.24 mm
10 μm: 51.2 x 51.2 mm
12 μm: 62.97 x 50.38 mm
15 μm: 76.8 x 61.4 mm

Inspection Performance
Imaging speed: 2.3 FOV/sec
Height resolution (examples):
9.8 μm: 0.4 μm
10 μm: 0.45 μm
12 μm: 0.45 μm
15 μm: 0.454 μm
Max. solder height on calibration target:
9.8–12 μm: 420 μm
15 μm: 470 μm

Motion Table & Control
X/Y/Z axes: Ballscrew + AC Servo with EtherCAT motion controller
X-Y axis resolution: 0.1 μm
Z-axis resolution: 0.1 μm

Board Handling
Max PCB size by model:
TR7007D SII: 510 x 460 mm
TR7007MD SII: 660 x 610 mm (optional: 660 x 690 mm)
TR7007D SII DL: 510 x 310 mm x 2 lanes or 510 x 590 mm x 1 lane
TR7007LD SII: 765 x 610 mm
PCB thickness: 0.5–6 mm
Max PCB weight:
TR7007MD SII / TR7007D SII (DL): 3 kg (optional: 5 kg)
TR7007LD SII: 3 kg (optional: 5 kg / 12 kg)
Top clearance: TR7007D SII (DL): 25 mm; TR7007MD SII / TR7007LD SII: 50 mm
Bottom clearance: 40 mm
Edge clearance: 3 mm (optional: 4 mm / 5 mm)
Conveyor height: 880–920 mm (optional: 940–965 mm)
* SMEMA compatible

Inspection Functions

• Detectable defects: Insufficient paste, Excessive paste, Shape deformity, Missing paste, Bridging
• Measurement parameters: Height, Area, Volume, Offset

Dimensions
WxDxH:
TR7007D SII: 1000 x 1480 x 1710 mm
TR7007MD SII: 1250 x 1740 x 1710 mm
TR7007D SII DL: 1000 x 1750 x 1710 mm
TR7007LD SII: 1365 x 1720 x 1710 mm
Note: dimensions do not include signal tower
Weight:
TR7007D SII: 795 kg
TR7007MD SII: 992 kg
TR7007D SII DL: 840 kg
TR7007LD SII: 1025 kg

Technical specifications

• Model: TR7007D SII
• Brand: TRI (Test Research, Inc.)
• Imaging method: Stop-and-Go Imaging
• Camera: 21 Mpix or 25 Mpix (factory setting)
• Imaging resolution options: 9.8 μm / 10 μm / 12 μm / 15 μm
• Field of view by resolution: see Optical System section
• Lighting: Wide Spectrum 2D (RGB+W); coaxial optional
• 3D tech: 2-way Digital Fringe Pattern; 100% shadow-free dual digital fringe projectors
• Imaging speed: 2.3 FOV/sec
• Height resolution example: down to 0.4 μm
• Max solder height example: up to 470 μm (depending on resolution)
• Motion control: Ballscrew + AC Servo on XYZ with EtherCAT motion controller
• XY/Z resolution: 0.1 μm
• PCB size & handling variants: see Board Handling section
• PCB thickness supported: 0.5–6 mm
• Conveyor height (std / optional): 880–920 mm (opt. 940–965 mm)
• Industry 4.0 readiness: supports IPC CFX and IPC Hermes 9852
• Smart features: SmartWarp compensation, real-time SPC trends, closed-loop feedback/feed-forward
• Optional items: Coaxial lighting, expanded PCB size/weight options, multi-lane configurations