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- Farley Laserlab
Farley Laserlab glass cutting machines
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Repeatability: 1 µm
Overall length: 1,450 mm
Maximum width: 1,700 mm
... laser wire cutting technology is used to cut the whole plate of the mobile phone camera protection glass to replace the traditional CNC processing mode. Picosecond laser cutting machine ...
Farley Laserlab
X travel: 80 mm - 110 mm
Maximum cutting height: 100 mm - 2,300 mm
Laser power: 40 W
... Adopt laser infrared picosecond filament cutting technology to cut automobile rearview mirrors, replacing cutter wheel cutting, optimizing the existing processing process High yields Hot and cold ...
Farley Laserlab
Laser power: 30 W
Repeatability: 1 µm
Overall length: 1,450 mm
... Picosecond laser wire cutting technology is used to cut the whole plate of the mobile phone camera protection glass to replace the traditional CNC processing mode. ● Use the picosecond wire- cutting ...
Farley Laserlab
Laser power: 0 W - 40 W
Repeatability: 1 µm
Overall length: 1,450 mm
... laser wire cutting technology is used to cut the whole plate of the mobile phone camera protection glass to replace the traditional CNC processing mode. Picosecond laser cutting machine ...
Farley Laserlab
Laser power: 0 W - 70 W
Repeatability: 1 µm
Overall length: 1,300 mm
... laser wire cutting technology is used to cut the whole plate of the mobile phone camera protection glass to replace the traditional CNC processing mode. Picosecond laser cutting machine ...
Farley Laserlab
X travel: 1,100 mm
Y travel: 800 mm
Maximum cutting height: 1 mm - 3 mm
... Adopt laser infrared picosecond filament cutting technology to cut automobile rearview mirrors, replacing cutter wheel cutting, optimizing the existing processing process ·High yields Hot and cold ...
Farley Laserlab
pulsed fiber laser cutting machine
Laser power: 40 W
Repeatability: 0.2 mm
Overall length: 3,700 mm
... perforators and short pulse width green light laser perforators are used for laser perforation of hard and brittle materials such as glass and quartz, and have the advantages of high processing yields, 7*24-hour continuous operation and ...
Farley Laserlab
X travel: 494 mm
Y travel: 882 mm
Z travel: 1,668 mm
... equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting speed and high positioning ...
Farley Laserlab
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