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Working temperature: -73 °C - 204 °C
Polymerization time: 1 h - 6 h
... is a two-part, heat-cured epoxy formulated to provide high thermal conductivity while maintaining electrical insulation and low thermal resistance. It uses small particle fillers (5–30 μm) enabling very thin bond lines for efficient heat ...
Master Bond
... exposure to air for complete cross-linking. It has a convenient ten to one mix ratio by weight, and will not outgas while curing. It is 100% solids and contains no solvents. MasterSil 151Med has an exceptionally low viscosity enabling ...
Master Bond
... it will generally set up in 30-45 minutes with full cures in 12-24 hours. If cured at 150°F the curing time will be 1-2 hours. When being used as an adhesive, the maximum area of effectiveness for X21 is about 1 square ...
Master Bond
... Key Features - Convenient handling and fast curing - Ideal for glob topping - Stellar electrical insulation properties - Withstands 1,000 hours 85°C/85% RH Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, ...
Master Bond
... Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low exotherm * High ...
Master Bond
... Key Features - Low viscosity - Minimal shrinkage upon curing - Superb optical clarity - Cures at 80°C in shadowed out areas Master Bond UV22DC80-1 is a nanosilica filled, dual cure epoxy based system. It is formulated to cure readily ...
Master Bond
... specifications • Minimal shrinkage upon curing • Cures at 80°C in shadowed out areas Master Bond UV22DC80-10F is a nanosilica filled, UV dual cure system. The secondary cure is accomplished by adding heat, with ...
Master Bond
... 158°F [60-70°C], 20-40 minutes at 176-212°F [80-100°C] or 10-20 minutes at 257°F [125°C]. To obtain optimum properties, post curing at 212-302°F [100-150°C] for 2-4 hours is recommended. Following an optimum cure schedule, Supreme 62-1 ...
Master Bond
... required - Cures at 175°F to 185°F - Good physical strength properties Master Bond Supreme 3HTS-80 is a one component, heat curing epoxy featuring good electrical conductivity and physical strength properties. ...
Master Bond
Working temperature: -60 °F - 350 °F
... One component, nanosilica filled, dual cure system with UV and heat curing mechanisms Key Features - Thixotropic paste - Minimal shrinkage upon curing - Low coefficient of expansion - Cures in ...
Master Bond