MasterBond low outgassing adhesives

1 company | 32 products
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epoxy adhesive
epoxy adhesive
EP54TC

Working temperature: -73 °C - 204 °C
Polymerization time: 1 h - 6 h

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  • Paste consistency for controlled application
  • Low coefficient of thermal expansion
  • Low thermal resistance for efficient heat transfer
  • Meets NASA low outgassing
  • ...

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    Master Bond
    UV-curing adhesive
    UV-curing adhesive
    UV24TKLO

    ... levels. The low outgassing properties enable this UV to be used in a wide array of optical, electro-optical and vacuum applications that until now have not been possible for UV curable systems. It should be noted that ...

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    Master Bond
    two-component adhesive
    two-component adhesive
    EP30LTE-LO

    ... EP30LTE-LO is a specialty epoxy system featuring an exceptionally low coefficient of thermal expansion (CTE) that meets NASA low outgassing specifications. It can be used in bonding, coating, sealing ...

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    Master Bond
    single-component adhesive
    single-component adhesive
    Supreme 3HTND-2CCM

    ... potting and coating system. Because it is thermally conductive, it transfers heat efficiently. This epoxy passes NASA low outgassing test requirements which allow it to be used in vacuum, aerospace and clean room applications. ...

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    Master Bond
    silicone adhesive
    silicone adhesive
    MasterSil 151TC

    ... filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low exotherm * High flexibility and temperature resistance Master Bond MasterSil 151TC is a two component ...

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    Master Bond
    single-component adhesive
    single-component adhesive
    EP36AO

    ... conductive & electrically insulative - Flexibilized and toughened - Unlimited working life at room temperature - Meets NASA low outgassing specifications Master Bond EP36AO is a unique one component, high performance ...

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    Master Bond
    UV-curing adhesive
    UV-curing adhesive
    UV22DC80-1

    ... Key Features - Low viscosity - Minimal shrinkage upon curing - Superb optical clarity - Cures at 80°C in shadowed out areas Master Bond UV22DC80-1 is a nanosilica filled, dual cure epoxy based system. It is formulated to cure readily ...

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    Master Bond
    epoxy adhesive
    epoxy adhesive
    EP17HTDA-1

    ... from -80°F to +600°F. Since it passes NASA low outgassing, it can be used in vacuum type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach and adhesive/sealant ...

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    Master Bond
    dual-curing adhesive
    dual-curing adhesive
    UV22DC80-10F

    ... high tech aerospace, electronics, optical and specialty OEM applications. Key Features • Thixotropic low viscosity • Meets NASA low outgassing specifications • Minimal shrinkage upon curing • Cures ...

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    Master Bond
    two-component adhesive
    two-component adhesive
    Supreme 62-1

    ... Superior Toughened Epoxy Chemically resistant, toughened epoxy, Master Bond Supreme 62-1, features excellent flow properties and a long working life. With a wide service temperature range of -60°F to 450°F, it resists acids, bases and solvents and offers ...

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    Master Bond
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