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Working temperature: -55 °C - 125 °C
... conductive epoxy combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. Click into part number to purchase online now. Parker Chomerics ...
Parker Chomerics Division
Working temperature: -55 °C - 125 °C
Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver-colored ...
Parker Chomerics Division
Working temperature: -62 °C - 100 °C
... CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required. CHO-BOND® 584-208 ...
Parker Chomerics Division
Working temperature: -62 °C - 100 °C
Packaging: 227, 454 ml
Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating. CHO-BOND® 580-208 is a silver-colored epoxy ...
Parker Chomerics Division
Working temperature: -62 °C - 100 °C
Packaging: 57 ml
Parker Chomerics TECKNIT 8116 conductive adhesive is a two-component, silver-filled epoxy formulated to provide a strong bond and electrical pathway between mating surfaces. TECKNIT 8116 is a silver-colored ...
Parker Chomerics Division
Working temperature: -62 °C - 100 °C
Packaging: 85, 454 ml
Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds. CHO-BOND® 360-20 is a light grey-colored ...
Parker Chomerics Division
Packaging: 500, 85 ml
Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics. CHO-BOND® 592 is ideal in connecting ...
Parker Chomerics Division
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