Box PC MIC-770 V3 series
desktopembeddedwall-mounted

Box PC - MIC-770 V3 series - ADVANTECH - desktop / embedded / wall-mounted
Box PC - MIC-770 V3 series - ADVANTECH - desktop / embedded / wall-mounted
Box PC - MIC-770 V3 series - ADVANTECH - desktop / embedded / wall-mounted - image - 2
Box PC - MIC-770 V3 series - ADVANTECH - desktop / embedded / wall-mounted - image - 3
Box PC - MIC-770 V3 series - ADVANTECH - desktop / embedded / wall-mounted - image - 4
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Characteristics

Type
box
Configuration
embedded, wall-mounted, desktop
Processor
12th Generation Intel® Core™, 13th Generation Intel® Core™, 14th Generation Intel® Core™
Ports
RJ45, HDMI, VGA, PCI Express, DDR5 SO-DIMM, DDR5, SATA, USB 2.0, M.2, NVMe, RS-422, RS-232, USB 3.0, mSATA, M.2 Key M, RS-485, gigabit Ethernet, Ethernet
Size
compact
Protection level
rugged, IP40
Other characteristics
fanless

Description

Overview
Compact fanless industrial embedded system for Intel® 12th/13th/14th Gen Core™ processors using an LGA1700 socket. Designed for harsh industrial environments with IP40 dust protection, wide input voltage and support for Advantech expansion modules and remote management technologies.

Key features
  • LGA1700 socket for Intel® 12th/13th/14th Gen Core™ (up to 24 cores, TDP up to 65 W)
  • Intel® R680E or H610E chipset options
  • 2 x Gigabit LAN; flexible USB configurations including USB 3.2 Gen2/Gen1
  • Optional serial ports: 2 x RS-232/422/485 and up to 4 x RS-232
  • Storage: 1 x 2.5" HDD/SSD bay, 1 x mSATA, optional NVMe M.2 (PCIe Gen4 x4)
  • 9 ~ 36 VDC wide-range input power for vehicle and industrial applications
  • IP40 dust-proof design and support for desktop or wall mounting
  • Supports FlexIO, iDoor and Advantech i-Modules for additional I/O (DP, DVI, COM, DIO, remote switch I/O)
  • Embedded software support: SUSI API, Advantech APIs and iBMC remote management (WISE-DeviceOn)
  • Security and platform management: Intel® vPro™/AMT and TPM support (model dependent)


Available model variants (as listed)
  • MIC-770V3W-00A1
  • MIC-770V3H-00A1
  • MIC-770V3W-E0A1
  • MIC-770V3H-E0A1
  • MIC-770V3W-00A2U


Technical specifications
  • Processor family: Intel® Core™ 12th/13th/14th Gen, up to 24 cores, TDP up to 65 W
  • Socket: 1 x LGA1700
  • Chipset: Intel® R680E or Intel® H610E (model dependent)
  • BIOS: AMI 256 / 128 Mbit SPI Flash
  • Memory: Dual-channel DDR5 4800 MHz; 2 x 262-pin DDR5 SO-DIMM; per-slot up to 64 GB; system max 128 GB
  • Graphics: Integrated Intel® UHD Graphics
  • Storage: 1 x 2.5" HDD/SSD bay; 1 x mSATA; 1 x M.2 2280 NVMe (PCIe Gen4 x4), M-Key (model dependent)
  • RAID: 0/1/5/10 on supported configurations
  • Expansion: i-Module, Mini PCIe / mSATA slots (model dependent)
  • LAN: 2 x RJ45 10/100/1000 Mbps (controller varies by model)
  • Display / front I/O: VGA and HDMI
  • USB: Configurable sets including USB 3.2 Gen2 / Gen1 and USB 2.0 (internal options)
  • COM ports: 2 x RS-232/422/485 (auto flow control) plus up to 4 x RS-232 optional
  • Audio: Line-out and Mic-in
  • Watchdog: Programmable reset interval (1–255 sec/min)
  • Power: ATX/AT type; 9 ~ 36 VDC input
  • Environment: Operating examples: -20 ~ 50 °C (with 0.7 m/s airflow); non-operating: -40 ~ 85 °C; humidity up to 95% @ 40 °C non-condensing
  • Shock: With SSD: 20 G, IEC-68-2-27, half-sine, 11 ms
  • Physical: Example dimensions: 77 x 192 x 230 mm or 107.3 x 192 x 230 mm; net weight examples: 2.8 kg or 4.65 kg
  • Mounting: Desktop, Wall mount
  • Certifications: CE / FCC Class A, CCC, BSMI, UL/CB (model dependent)

Catalogs

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Exhibitions

Meet this supplier at the following exhibition(s):

TAIROS 2026
TAIROS 2026

19-22 Aug 2026 Taipei (Taiwan Region)

  • More information
    InnoTrans 2026
    InnoTrans 2026

    22-25 Sep 2026 Berlin (Germany) Hall 4.1 - Stand 370

  • More information

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