Diamond wire squaring machine KFD900

high-speed cutting

Product overview
This machine uses a high-speed grid diamond-wire array that moves longitudinally to cut silicon ingots. The ingot is clamped at both ends without adhesive and the prism edge is automatically aligned. Integrated robotic loading/unloading enables efficient squaring of monocrystalline silicon ingots for solar wafer production.

Key features

• Single-ingot squaring reduces manual handling, energy consumption and cost while maintaining high throughput.
• Fully automatic robotic loading/unloading transports ingots at the rotary storage/loading station, shortening transfer time.
• Capable of integration with workshop automation for unattended operation.
• Designed for continuous, high-efficiency squaring of monocrystalline silicon ingots in photovoltaic manufacturing.

Product details
1. The machine performs single-ingot squaring and, compared with multi-ingot equipment, reduces handling, energy use and cost while ensuring high productivity. 2. The fully automatic robot can handle ingots directly at the rotary loading/storage table, reducing transfer time. 3. The machine can be networked with workshop automation to achieve automatic operation and save labor.

Main technical parameters (table form)
Diamond wire diameter: 0.25-0.42 mm
Maximum wire speed: 25 m/s
Tension range: 0~130 N
Cutting feed: ≥40 mm/min
Rapid traverse speed: 1000 mm/min
Processing margin range: 166–210 mm
Wire reserve length: 10 km
Ingot clamping length: 200–900 mm (common 325–700 mm)
Clamped ingot diameter: φ210–310 mm (typical: 215 mm / 8.4")
Vertical travel: 700 mm
Longitudinal travel: 940 mm
Lateral travel: 450 mm

Specifications

• Product name: Diamond wire single-ingot squaring machine
• Product number: KFD900
• Category: Green manufacturing equipment
• Views: 1735
• Summary: Uses a grid diamond-wire array moving longitudinally to cut silicon ingots; end clamping without adhesive for squaring of monocrystalline silicon ingots
• Retail price: 0.00 CNY
• Market price: 0.00 CNY
• Common clamping length range: 325–700 mm
• Clamped ingot diameter range: φ210–310 mm