TR-5310EX use a thermal conductive adhesive, providing remarkable conductivity.
Superior thermal conductivity by a low value of thermal resistance.
Features
Low thermal resistance and superior thermal conductivity.
Powerful adhesion for remarkable strength and reliability.
Features excellent workability and processability.
Does not contain the 10 substances restricted by RoHS Directive.
Applications
For fixing LED base board and housing.
For fixing CPU and heat sink or radiation fin.
For fixing various types of semiconductor package and heat sink.
For fixing electronic parts and heat sink.