EDGE PC Karbon 525

AIGPUAI Inference

Overview
The Karbon 525 is a rugged, fanless industrial computer designed for extreme edge environments that require sustained AI inference or advanced graphics. It combines Intel Core Ultra processing with an isolated MXM expansion compartment configurable with NVIDIA MXM AI GPUs. The system supports up to 96 GB DDR5, multiple NVMe/storage options and a wide automotive DC input range.

Highlights

• NVIDIA MXM AI GPU expansion (isolated MXM compartment)
• 6× USB 3.2 Gen2 (Type-A), 2× Thunderbolt 4 (USB-C), 4× 2.5 GbE LAN
• Operating temperature: -40 °C to 70 °C
• Automotive power input (12–48 VDC) with programmable ignition timing
• Intel Core Ultra processors for enhanced edge AI capability

Rugged design & certifications

• Hybrid passive/active cooling (fanless conduction with optional fan-hat for heavy loads)
• Vibration and shock tested (MIL-STD-810 / IEC 60068 series)
• Certifications and compliance for industrial, in-vehicle, rail, maritime and medical applications
• Mounting: DIN rail, wall, VESA and rack options

Connectivity & I/O

• Front I/O: Power button, factory reset, 3.5 mm audio, 6× USB 3.2 Gen2 Type-A, 2× Thunderbolt 4 (40 Gb/s), 4× 2.5 GbE LAN
• Rear I/O: 2× DisplayPort 2.1 (UHBR20), optional 4× COM (RS232/422/485), optional CAN, optional DIO
• Onboard I/O: 4-pin terminal block power, 3FF SIM (mapped to M.2 B-Key), antenna mounts, grounding lug, remote switch, fan-hat connector
• Supports up to 4 displays

Expansion & storage

• Isolated MXM GPU slot (e.g. NVIDIA RTX A1000 / A2000 / A4500 MXM options)
• M.2: M.2 2280 M-Key (PCIe Gen4 x4) plus additional M.2 B-Key and 2242/60 slots depending on configuration
• Optional 2× 2.5" SSD bays (platform-dependent) and multiple NVMe/SATA combinations
• 3FF SIM mapped to B-Key for cellular modem options (4G LTE, Wi‑Fi, Bluetooth optional)

Additional product features

• Onboard TPM 2.0 (Infineon SLB9672)
• Intel vPro / AMT remote management when supported by CPU
• Automotive features: ignition sensing and wide input range
• Support for optional AI inference accelerators and OEM configurations

Technical specifications

• Brand: OnLogic
• Model: Karbon 525
• Hardware line: Rugged
• Cooling: Hybrid fanless / actively cooled (optional)
• Processor family: Intel Core Ultra (Meteor Lake / Arrow Lake options)
• Memory: DDR5 up to 96 GB (5600 MT/s, dual-channel)
• Graphics: Intel ARC integrated; optional NVIDIA MXM GPUs
• LAN: Intel I226IT (4× 2.5 GbE)
• I/O summary: Front and rear I/O as listed above
• Expansion: MXM GPU, M.2 M-Key/B-Key slots, optional 2× 2.5" SSD bays
• Storage: NVMe/SATA M.2 options (2242/60, 2280), M.2 B-Key for modem
• Power input: DC wide 12–48 V (terminal block); 5-pin terminal connector
• Dimensions: 106 × 177 × 225 mm; Weight: 4.13 kg
• Operating temperature: -40 °C to 70 °C; Humidity: 5%–95% non-condensing
• Certifications: CISPR/EN 55032/55035, EN 60601-1-2 (4th ed.), EN 62368-1, EN 60945, TAA, UKCA, CE
• Compatible OS: Red Hat, Ubuntu (per documentation)