Edge AI PC Karbon 523

artificial intelligenceEDGEAI

Overview
The Karbon 523 is a rugged, fanless industrial computer designed for edge, mobile and in-vehicle applications that require modular, front-accessible I/O. It integrates Intel® Core™ Ultra processing and Intel ARC graphics to support AI-capable workloads and offers two ModBay expansion slots for customizable connectivity. Automotive power input (12–48 VDC) with programmable ignition sensing and an extended operating range enable deployment in harsh environments.

Key Highlights

• Dual front-accessible ModBay expansion for modular I/O
• Front I/O: 6× USB 3.2 Gen2 Type-A, 2× Thunderbolt 4/USB-C (40 Gb/s), 4× 2.5 GbE LAN, power button, factory reset switch, 3.5 mm audio
• Rear/side I/O: 2× DisplayPort 2.1 (UHBR20); optional 4× COM (RS-232/422/485), optional CAN, optional DIO
• Operating range: -40°C to 70°C; automotive power 12–48 VDC with programmable ignition sensing
• Intel Core Ultra processors with enhanced AI capability; optional AI accelerators (e.g., Hailo)

Performance and Storage
Supports up to 96 GB DDR5 (5600 MT/s) in dual-channel configuration. Multiple M.2 slots include 2× M.2 2280 M-Key (PCIe Gen4, SATA III options) and an M.2 B-Key for modem/expansion. vPro/AMT support available depending on CPU selection; remote management (KVM, firmware updates) supported where applicable.

Rugged Design
Passively cooled, low-profile chassis optimized for DIN, wall, VESA and rack mounting. Designed and tested for continuous vibration and shock (MIL-STD-810H) and extensive EMC/medical/rail/marine testing (EN 60601-1-2, CISPR/EN EMC standards). Constructed from aluminum extrusion and steel for mobile and space-constrained platforms.

I/O Flexibility & ModBay
The two ModBay slots accept modules such as 10 GbE, PoE, M12, additional USB or extra RJ45 ports. Onboard features include SIM mapping to M.2 B-Key for cellular, multiple antenna mounting holes, grounding lug and remote switch — enabling complex connectivity at the edge.

Certifications & Environmental
Compliance and testing include UL, RoHS, FCC, CE, CISPR 32/35, EN 55032/55035, EN 60601-1-2 (4th ed.), EN 62368-1, TAA, UKCA and WEEE. Designed for non‑condensing humidity (5%–95%) and shock/vibration per industry standards.

Technical Specifications

• Hardware line: Rugged
• Cooling: Fanless (passive)
• Processor: Onboard BGA, Intel® Core™ Ultra (Series 1/2 options)
• Processor examples: Core Ultra 5 125H, 135H; Core Ultra 7 165H
• TDP: ~28 W (varies by SKU)
• Memory: DDR5 up to 96 GB (5600 MT/s), dual channel
• Graphics: Intel ARC Graphics (integrated)
• Front I/O: 6× USB 3.2 Gen2 (Type A), 2× Thunderbolt 4/USB-C, 4× 2.5 GbE, power button, factory reset, 3.5 mm jack
• Rear/side I/O: 2× DisplayPort 2.1 UHBR20; optional 4× COM, CAN, DIO; 1× 4-pin terminal block power; SIM 3FF (mapped to M.2 B-Key); 6× antenna holes
• Expansion: 2× ModBay front-accessible; 1× M.2 2280 M-Key (PCIe Gen4 x4); 1× M.2 B-Key
• Storage: M.2 2242/60/80 B-Key and M-Key options
• Connectivity: 4G LTE (optional), Wi‑Fi, Bluetooth; carrier support configurable
• Dimensions: 106 × 177 × 225 mm; Weight: 3.58 kg
• Materials: Aluminum extrusion and steel
• Power input: Automotive wide input 12–48 VDC (min. 19 V indicated for some SKUs); 5-pin terminal block connector
• Operating temp: -40°C to 70°C; Humidity: 5%–95% non‑condensing
• Shock & vibration: IEC 60068-2-27, MIL-STD-810G/H
• Security & features: TPM 2.0 (Infineon SLB9672), Secure Boot, optional Intel vPro remote management
• Included accessories: 1× 4-pin terminal block mating connector