Eutectic die bonder 3880-II

epoxyautomated

A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The new Palomar 3880-II Die Bonder is based on Palomar’s proven die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible Palomar 3880-II is ideally suited for a range of markets and applications. Processes Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding, Thermocompression Die Bonding AOC - Active optical cable Chip-on-board CMOS sensors GaN/GaAs MMIC HB/HP LED assembly HPLD (high power laser diode) Hybrid microcircuits LiDAR Medical semiconductor & sensors MEMS / MOEMS Microwave modules Power electronics Quantum computing RF GaN 5G power amplifiers RF packages VCSEL, PD, DFB Laser, Lens Attach