Automatic grooving machine GC-LMKC01

CNC

Product Introduction
The GC-LMKC01 is a laser grooving machine for WGR (wire guide roller) used in the silicon wafer slicing process. It employs an ultrafast laser system that minimizes the heat-affected zone and enables non-contact cutting, reducing radial pressure on the WGR. This improves grooving accuracy to meet stringent precision requirements during wafer slicing. The system supports various ultra-fine diamond wire types and process settings to help increase silicon wafer slicing yield.

Product Parameters
Processing length range: 890~1080 mm
Processing diameter range: 130~180 mm
Grooving length: >960 mm
Processing method: laser
Equipment size (L×W×H): 3600×1750×1950 mm
Equipment weight: 5500 kg

Technical specifications

• Model: GC-LMKC01
• Application: WGR (Wire Guide Roller) grooving for silicon wafer slicing
• Laser system: ultrafast laser
• Processing method: non-contact laser cutting to reduce radial pressure and heat-affected zone
• Processing length range: 890~1080 mm
• Processing diameter range: 130~180 mm
• Grooving length: >960 mm
• Equipment size (L×W×H): 3600×1750×1950 mm
• Equipment weight: 5500 kg
• Compatible with various ultra-fine diamond wires to improve slicing yield