Wire cutting machine GC-800XC

for monocrystalline siliconwaferwith control software

Product introduction
This machine is designed for the slicing stage of crystalline silicon wafer manufacturing and was launched in November 2024. Its adjustable small-wheelbase design accommodates multiple wafer/rod formats (16X / 18X / 210 / 220 / 230 mm) and supports development trends for next-generation cells (HJT, TOPCon) such as larger sizes, thinner slices, half cells and rectangular wafers.

Key Features
The GC-800XC uses a renewed cutting-area layout with a maximum silicon ingot loading capacity of 950 mm. The cutting configuration enables multi-gear wheelbase modes across 315 mm – 370 mm – 400 mm – 455 mm at a wire speed up to 2600 m/min. A lightweight high-precision wiring system reduces tension fluctuation; whole-machine added tension is < 1 N and the comprehensive broken-line rate is < 5%. The machine supports stable cutting with wire diameters of 18 μm and below, offers low overall energy consumption and provides multiple automation interfaces for intelligent, data-driven production control.

Product Parameters
Size of silicon rod: □166 ~ □230 × LMax.950 mm (compatible with half wafer)
Maximum line speed: 2600 m/min
Wheelbase: 315 ~ 455 mm
Storage capacity (wire): 240 km
Equipment dimensions (approx.): 5110 × 2481 × 3275 mm
Equipment weight (approx.): 12,500 kg

Technical specifications

• Model name: GC-800XC
• Application: Slicing stage for crystalline silicon wafer manufacturing
• Maximum ingot loading capacity: 950 mm
• Supported wafer/rod sizes: □166 ~ □230; supports 16X/18X/210/220/230 mm and half wafer
• Wire speed (maximum line speed): 2600 m/min
• Wheelbase modes: multi-gear 315 mm – 370 mm – 400 mm – 455 mm
• Whole-machine added tension: < 1 N
• Comprehensive broken-line rate: < 5%
• Wire diameter capability: stable cutting at 18 μm and below
• Storage capacity (wire): 240 km
• Equipment dimensions (approx.): 5110 × 2481 × 3275 mm
• Equipment weight (approx.): 12,500 kg
• Features: lightweight high-precision wiring system, low energy consumption, automation interfaces for intelligent production and data-driven control