Optical inspection system SAWR

cameraautomatedvideo

Overview
Device for detailed analysis of NG images, storage of analysis data, and communication with host PC based on information provided by wafer inspection system.

Use
Defect management in semiconductor device / CMOS device manufacturing process.

System description
The system acquires defect images and uploads the data to the upstream system. Defect coordinates and metadata are provided by the Wafer Review System and Wafer Inspection System (AVI). The system also analyzes defect information from AVI. Seiwa SAWR Series inspects applications at high speed with high precision. AVI can be manufactured on request.

Specification

• Applicable wafer sizes: 12 inch / 8 inch
• Work state: Wafer dicing
• Stage positioning accuracy: ± 1 µm
• Review accuracy: 3σ ≤ ± 20 µm (positioning accuracy for defect coordinates)
• Throughput: Approximately 2000 seconds (10-sheet processing) — reference imaging mode; depends on defect location
• Review time (move to AF and image): fastest 0.5 seconds — depends on defect location

Technical specifications

• Applicable wafer sizes: 12 inch / 8 inch
• Work state: Wafer dicing
• Stage positioning accuracy: ± 1 µm
• Review accuracy: 3σ ≤ ± 20 µm
• Throughput: Approximately 2000 seconds (10-sheet processing)
• Number of defects considered: 100 per wafer
• Review time (move to AF and image): fastest 0.5 seconds