Wafer mask aligner

fully-automatic

Overview
This wafer exposure (mask aligner) integrates an original UV optical system optimized for high‑definition exposure and a precision mechanism to parallelize photomask and wafer. The Full Automatic Exposure System supports three gap control modes: Vacuum contact, Soft Contact and Proximity Gap.

Applications

• Power devices
• Backside processing of CMOS
• MEMS fabrication
• LED production
• Ceramic substrates

Key specifications

• Type: Full Automatic type (for 2–12 inch wafers or square shape)
• Optical system: Original UV optical system optimized for high‑definition exposure
• Gap control modes: Vacuum contact; Soft Contact; Proximity Gap
• Available wafer sizes: 12 inch; 6–8 inch; 4–6 inch; 2–4 inch; Square shape
• Loading method: Cassette to Cassette; Foup Load
• Alignment directions: Top side; Back side (optional)
• Alignment accuracy: Top side ±0.8 μm or less; Back side ±1 μm or less

Operational highlights

• High-precision parallel alignment between mask and wafer for repeatable pattern fidelity
• Flexible gap control to accommodate contact and proximity processes
• Compatibility with standard cassette and FOUP workflows for cleanroom integration