Overview1× magnification projection exposure system equipped with original high NA projection optics, compatible with thin and thick photoresists. System configuration is adaptable and transfer systems can be proposed depending on the application, including wafer and FPC handling.
Applications- MEMS fabrication
- LED component patterning
- Crystal and optical component processing
- FPC and flexible substrate exposure
- Other microfabrication processes
Technical specifications- Maximum substrate size: up to 6 inches
- Magnification: 1×
- Projection optics: high numerical aperture (NA)
- Alignment accuracy: ± 1 μm
- Backside alignment: available as an option
- Adaptable transfer systems: wafer and FPC (configurable)