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Wafer mask aligner
benchtopautomaticfor production

Wafer mask aligner - SEIWAOPTICAL - benchtop / automatic / for production
Wafer mask aligner - SEIWAOPTICAL - benchtop / automatic / for production
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Characteristics

Options
for wafers, automatic, benchtop, for production, for laboratory

Description

Overview
  • Bench-top wafer exposure system (mask aligner) designed for R&D and small-lot production environments.
  • Supports three gap control modes: Hard contact, Soft contact and Proximity gap.


Applications
  • Suitable for glass, wafers, films and ceramic substrates.
  • Laboratory R&D, prototyping and small-batch manufacturing.


Key features
  • Selectable alignment: manual or automatic alignment options.
  • Selectable gap control: automatic or manual gap adjustment modes.
  • Manual load/unload for flexible handling of diverse substrate types.


Specifications
  • Work sizes: 12 inch, 6-8 inch, 4-6 inch, 2-4 inch and square formats.
  • Load/unload: Manual.
  • Alignment method: Manual or automatic (selectable).
  • Gap control: Automatic or manual (selectable).
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.